Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 039262/0614 | |
| Pages: | 5 |
| | Recorded: | 07/26/2016 | | |
| Attorney Dkt #: | 70027-1748 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2016
|
Application #:
|
14282598
|
Filing Dt:
|
05/20/2014
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSER AND METHOD OF MANUFACTURE THEREOF
|
|
|
Assignee
|
|
|
|
|
| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
|
|
Correspondence name and address
|
| |
WONG & REES LLP
|
| |
4677 OLD IRONSIDES DRIVE
|
| |
SUITE 370
|
| |
SANTA CLARA, CA 95054
|
Search Results as of:
05/30/2024 08:52 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
