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Reel/Frame:029123/0616   Pages: 2
Recorded: 10/12/2012
Attorney Dkt #:100BK-027700US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/02/2014
Application #:
13651161
Filing Dt:
10/12/2012
Publication #:
Pub Dt:
07/04/2013
Title:
Method for fabricating semiconductor device having buried gate
Assignor
1
Exec Dt:
09/24/2012
Assignee
1
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO
ICHEON, KOREA, REPUBLIC OF 467-734
Correspondence name and address
AMPACC LAW GROUP, PLLC
6100 219TH STREET SW, SUITE 580
MOUNTLAKE TERRACE, WA 98043

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