Patent Assignment Details
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| Reel/Frame: | 051061/0616 | |
| Pages: | 3 |
| | Recorded: | 11/20/2019 | | |
| Attorney Dkt #: | 106P000565US.DIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/18/2020
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Application #:
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16689234
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Filing Dt:
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11/20/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Title:
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PACKAGE STRUCTURE OF A FOLDING MAGNETIC COUPLING ISOLATOR, LEADFRAME COMPONENT, AND LEADFRAME STRUCTURE
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Assignee
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| 151 LORONG CHUAN, #03-03, NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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