Patent Assignment Details
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| Reel/Frame: | 017994/0618 | |
| Pages: | 4 |
| | Recorded: | 06/02/2006 | | |
| Attorney Dkt #: | WSAG 0163 PUS |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE RECEIVING PARTY. DOCUMENT PREVIOUSLY RECORDED AT REEL 017208 FRAME 0643. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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11268356
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Filing Dt:
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11/07/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Title:
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METHOD AND APPARATUS FOR LEVELING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER WITH IMPROVED FLATNESS
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Assignee
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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Correspondence name and address
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WILLIAM G. CONGER
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BROOKS KUSHMAN PC
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1000 TOWN CENTER
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22ND FLOOR
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SOUTHFIELD, MI 48075-1238
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