Patent Assignment Details
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Reel/Frame: | 027391/0620 | |
| Pages: | 4 |
| | Recorded: | 12/15/2011 | | |
Attorney Dkt #: | CHIA3115/REF/LES |
Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12076470
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Filing Dt:
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03/19/2008
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Publication #:
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Pub Dt:
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09/24/2009
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Title:
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PACKAGE STRUCTURE IN WHICH CORELESS SUBSTRATE HAS DIRECT ELECTRICAL CONNECTIONS TO SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
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Assignee
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38, HSING PONG RD. |
KWEI SAN INDUSTRIAL ZONE |
TAOYUAN, TAIWAN |
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Correspondence name and address
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BACON & THOMAS, PLLC
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625 SLATERS LANE
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4TH FLOOR
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ALEXANDRIA, VA 22314-1176
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