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Reel/Frame:065296/0622   Pages: 4
Recorded: 10/20/2023
Attorney Dkt #:91024-657
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 12
1
Patent #:
Issue Dt:
05/21/2019
Application #:
15390951
Filing Dt:
12/27/2016
Publication #:
Pub Dt:
04/20/2017
Title:
HIGH-VOLTAGE LIGHT EMITTING DIODE CHIP AND FABRICATION METHOD
2
Patent #:
Issue Dt:
02/09/2021
Application #:
15859659
Filing Dt:
12/31/2017
Publication #:
Pub Dt:
05/03/2018
Title:
Transfer Head for Transferring Micro Element and Transferring Method of Micro Element
3
Patent #:
Issue Dt:
05/05/2020
Application #:
15859729
Filing Dt:
01/01/2018
Publication #:
Pub Dt:
05/03/2018
Title:
Transfer Head for Transferring Micro Element and Transferring Method of Micro Element
4
Patent #:
Issue Dt:
09/10/2019
Application #:
15871982
Filing Dt:
01/16/2018
Publication #:
Pub Dt:
06/07/2018
Title:
MICRO ELEMENTS TRANSFER DEVICE AND METHOD
5
Patent #:
Issue Dt:
09/21/2021
Application #:
15929677
Filing Dt:
05/15/2020
Publication #:
Pub Dt:
08/27/2020
Title:
METHOD FOR MASS TRANSFER OF MICRO SEMICONDUTOR ELEMENTS
6
Patent #:
Issue Dt:
04/14/2020
Application #:
16522641
Filing Dt:
07/25/2019
Publication #:
Pub Dt:
11/14/2019
Title:
Micro Elements Transfer Device and Method
7
Patent #:
Issue Dt:
08/23/2022
Application #:
16818872
Filing Dt:
03/13/2020
Publication #:
Pub Dt:
07/09/2020
Title:
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING MICRO LIGHT EMITTING DIODE DEVICE INCLUDING THE SAME
8
Patent #:
Issue Dt:
08/24/2021
Application #:
16865186
Filing Dt:
05/01/2020
Publication #:
Pub Dt:
08/13/2020
Title:
PROCESS FOR PACKAGING COMPONENT
9
Patent #:
Issue Dt:
11/03/2020
Application #:
16887877
Filing Dt:
05/29/2020
Publication #:
Pub Dt:
11/19/2020
Title:
LIGHT-EMITTING DIODE
10
Patent #:
Issue Dt:
09/27/2022
Application #:
16895119
Filing Dt:
06/08/2020
Publication #:
Pub Dt:
09/24/2020
Title:
LIGHT-EMITTING DIODE AND METHOD FOR TRANSFERRING THE SAME
11
Patent #:
Issue Dt:
04/18/2023
Application #:
17139976
Filing Dt:
12/31/2020
Publication #:
Pub Dt:
04/29/2021
Title:
Transfer Head for Transferring Micro Element and Transferring Method of Micro Element
12
Patent #:
Issue Dt:
01/17/2023
Application #:
17447325
Filing Dt:
09/10/2021
Publication #:
Pub Dt:
12/30/2021
Title:
METHOD AND DEVICE FOR MASS TRANSFER OF MICRO SEMICONDUCTOR ELEMENTS
Assignor
1
Exec Dt:
09/19/2023
Assignee
1
NO. 18, GAOXIN 5TH ROAD, GEDIAN DEVELOPMENT AREA, HUBEI
EZHOU, CHINA
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD. SUITE 405
VIENNA, VA 22182

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