Patent Assignment Details
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Reel/Frame: | 023218/0625 | |
| Pages: | 2 |
| | Recorded: | 09/11/2009 | | |
Attorney Dkt #: | 92000-156 (PA-1063) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12557805
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Filing Dt:
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09/11/2009
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Publication #:
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Pub Dt:
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03/17/2011
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Title:
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PACKAGE METHOD OF MICRO-ELECTRO-MECHANICAL SYSTEM CHIP
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Assignee
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5F, NO. 5, INNOVATION ROAD I, HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN |
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Correspondence name and address
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TUNG & ASSOCIATES / RANDY W. TUNG, ESQ.
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838 W. LONG LAKE RD.
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SUITE 120
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BLOOMFIELD HILLS, MI 48302
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