Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 035323/0626 | |
| Pages: | 4 |
| | Recorded: | 04/02/2015 | | |
Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08471739
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Filing Dt:
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06/06/1995
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Title:
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METHOD FOR PACKAGING AN INTEGRATED CIRCUIT USING A RECONSTRUCTED PACKAGE
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10041717
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Filing Dt:
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01/07/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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METHOD FOR DECONSTRUCTING AN INTEGRATED CIRUIT PACKAGE USING LAPPING
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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10041720
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Filing Dt:
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01/07/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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METHOD FOR RECONSTRUCTING AN INTEGRATED CIRCUIT PACKAGE USING LAPPING
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Assignee
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31398 HUNTWOOD AVENUE |
HAYWARD, CALIFORNIA 94544 |
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Correspondence name and address
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STACEY A. MORDAS
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400 ATLANTIC AVENUE
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BOSTON, MA 02110
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