Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 012153/0627 | |
| Pages: | 12 |
| | Recorded: | 09/19/2001 | | |
| Conveyance: | SECURITY AGREEMENT |
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Total properties:
3
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Patent #:
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Issue Dt:
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07/25/2000
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Application #:
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09055193
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Filing Dt:
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04/04/1998
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Title:
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HIGH-DENSITY COMPUTER MODULES WITH DOUBLE-LAYER PACKAGING
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Patent #:
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Issue Dt:
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12/12/2000
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Application #:
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09207490
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Filing Dt:
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12/08/1998
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Title:
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MULTI-CHIP PACKAGE WITH STACKED CHIPS AND INTERCONNECT BUMPS
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09228867
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Filing Dt:
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01/12/1999
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Title:
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HIGH-DENSITY COMPUTER MODULE WITH STACKED PARALLEL-PLANE PACKAGING
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Assignee
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| 300 S. GRAND AVE., 3RD FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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Correspondence name and address
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KELLEY DRYE & WARREN LLP
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DANIELLE V. GARCIA
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777 SOUTH FIGUEROA STREET, SUITE 2700
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LOS ANGELES, CA 90017-5825
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