Patent Assignment Details
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| Reel/Frame: | 013033/0628 | |
| Pages: | 3 |
| | Recorded: | 03/22/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10104263
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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09/25/2003
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Title:
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Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
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Assignee
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| QPL INDUSTRIAL BUILDING |
| 138 TEXACO ROAD |
| TSEUN WAN, NT, HONG KONG |
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Correspondence name and address
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MILBANK, TWEED, HADLEY & ET AL.
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CHRISTOPHER J. GASPAR
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ONE CHASE MANHATTAN PLAZA
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NEW YORK, NY 1005
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