Patent Assignment Details
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| Reel/Frame: | 014378/0629 | |
| Pages: | 4 |
| | Recorded: | 08/07/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10636105
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Filing Dt:
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08/07/2003
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Publication #:
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Pub Dt:
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02/10/2005
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Title:
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Integrated underfill process for bumped chip assembly
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Assignee
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| 1676 LINCOLN AVENUE |
| UTICA, NEW YORK 13503 |
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Correspondence name and address
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WEINGARTEN, SCHURGIN, GAGNEBIN ET AL.
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STANLEY M. SCHURGIN
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TEN POST OFFICE SQUARE
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BOSTON, MA 02109
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