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392
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09929239
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Filing Dt:
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08/13/2001
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Title:
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LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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09929428
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Filing Dt:
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08/13/2001
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Title:
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LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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09931144
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Filing Dt:
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08/16/2001
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Title:
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SOLDERABLE INJECTION-MOLDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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11/05/2002
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Application #:
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09932109
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Filing Dt:
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08/16/2001
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Title:
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INTEGRATED CIRCUIT PACKAGE INCLUDING PIN AND BARREL INTERCONNECTS
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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09932528
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Filing Dt:
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08/17/2001
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Title:
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SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH LASER-FORMED APERTURE THROUGH SOLDER MASK LAYER
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09934040
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Filing Dt:
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08/21/2001
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Publication #:
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Pub Dt:
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03/06/2003
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Title:
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METHOD AND CIRCUIT MODULE PACKAGE FOR AUTOMATED SWITCH ACTUATOR INSERTION
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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09940103
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Filing Dt:
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08/27/2001
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Title:
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VCSEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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09943068
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Filing Dt:
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08/29/2001
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Title:
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PLACEMENT TEMPLATE AND METHOD FOR PLACING OPTICAL DIES
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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09946750
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Filing Dt:
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09/04/2001
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Title:
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QUICK SEALING GLASS-LIDDED PACKAGE
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09946861
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Filing Dt:
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09/04/2001
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Title:
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QUICK SEALING GLASS-LIDDED PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09953422
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Filing Dt:
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09/14/2001
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Title:
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SEMICONDUCTOR PACKAGE HAVING MULTIPLE DIES WITH INDEPENDENTLY BIASED BACK SURFACES
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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09956190
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Filing Dt:
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09/19/2001
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Title:
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LEAD-FRAME METHOD AND ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE
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Patent #:
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Issue Dt:
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04/29/2003
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Application #:
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09974541
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Filing Dt:
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10/09/2001
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Title:
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SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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09976866
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Filing Dt:
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10/12/2001
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Publication #:
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Pub Dt:
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04/17/2003
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WITH SINGULATION CREASE
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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09978535
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Filing Dt:
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10/15/2001
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Title:
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APPARATUS AND METHOD FOR ALLOWING TESTING OF SEMICONDUCTOR DEVICES AT DIFFERENT TEMPERATURES
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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09996226
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Filing Dt:
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11/27/2001
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Title:
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MULTI-LAYER LEAD FRAME STRUCTURE
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Patent #:
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Issue Dt:
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08/12/2003
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Application #:
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09998844
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Filing Dt:
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10/19/2001
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Publication #:
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Pub Dt:
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09/19/2002
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WITH OPTIMIZED LEADFRAME BONDING STRENGTH
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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10006642
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Filing Dt:
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12/05/2001
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Publication #:
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Pub Dt:
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04/18/2002
| | | | |
Title:
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PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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10007337
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Filing Dt:
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10/22/2001
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Publication #:
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Pub Dt:
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04/04/2002
| | | | |
Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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|
Issue Dt:
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10/07/2003
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Application #:
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10008048
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Filing Dt:
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11/07/2001
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Title:
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POWER SEMICONDUCTOR PACKAGE WITH STRAP
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Patent #:
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Issue Dt:
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10/07/2003
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Application #:
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10012378
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Filing Dt:
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12/12/2001
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Title:
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SENSOR MODULE WITH INTEGRATED DISCRETE COMPONENTS
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10013160
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Filing Dt:
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12/10/2001
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Publication #:
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Pub Dt:
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10/03/2002
| | | | |
Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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10013396
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Filing Dt:
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12/07/2001
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Title:
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STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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10/12/2004
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Application #:
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10034656
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Filing Dt:
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12/26/2001
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Publication #:
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Pub Dt:
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07/04/2002
| | | | |
Title:
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SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP
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Patent #:
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Issue Dt:
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08/09/2005
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Application #:
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10043946
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Filing Dt:
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01/11/2002
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Publication #:
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Pub Dt:
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07/18/2002
| | | | |
Title:
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REDUCED SIZE SEMICONDUCTOR PACKAGE WITH STACKED DIES
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10046995
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Filing Dt:
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01/14/2002
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Publication #:
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Pub Dt:
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07/18/2002
| | | | |
Title:
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OPTICAL DEVICE PACKAGES HAVING IMPROVED CONDUCTOR EFFICIENCY, OPTICAL COUPLING AND THERMAL TRANSFER
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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10054124
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Filing Dt:
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01/22/2002
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING RINGS STRUCTURE CONNECTED TO LEADS WITH VERTICALLY DOWNSET INNER ENDS
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Patent #:
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|
Issue Dt:
|
08/31/2004
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Application #:
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10067068
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Filing Dt:
|
02/06/2002
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Title:
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THIN INTEGRATED CIRCUIT PACKAGE HAVING AN OPTICALLY TRANSPARENT WINDOW
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Patent #:
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|
Issue Dt:
|
12/30/2003
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Application #:
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10068717
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Filing Dt:
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02/05/2002
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Title:
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INTEGRATED CIRCUIT PACKAGE MOUNTING
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Patent #:
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|
Issue Dt:
|
03/23/2004
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Application #:
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10078718
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Filing Dt:
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02/19/2002
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Publication #:
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|
Pub Dt:
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08/21/2003
| | | | |
Title:
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ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES
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|
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Patent #:
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|
Issue Dt:
|
06/10/2003
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Application #:
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10086293
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Filing Dt:
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02/28/2002
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Title:
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THIN SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIP AND ELECTRONIC DISCRETE DEVICE
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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10093267
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Filing Dt:
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03/05/2002
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Title:
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REDUCED COPPER LEAD FRAME FOR SAW-SINGULATED CHIP PACKAGE
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Patent #:
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Issue Dt:
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01/21/2003
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Application #:
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10094731
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Filing Dt:
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03/08/2002
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Title:
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LOW PROFILE MOUNTING OF THICK INTEGRATED CIRCUIT PACKAGES WITHIN LOW-PROFILE CIRCUIT MODULES
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10097905
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Filing Dt:
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03/13/2002
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Title:
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FLIP-CHIP MICROMACHINE PACKAGE USING SEAL LAYER
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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10103048
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Filing Dt:
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03/21/2002
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Publication #:
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Pub Dt:
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10/03/2002
| | | | |
Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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|
Issue Dt:
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08/03/2004
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Application #:
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10115218
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Filing Dt:
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04/02/2002
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Publication #:
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Pub Dt:
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10/17/2002
| | | | |
Title:
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CARRIER FRAME AND SEMICONDUCTOR PACKAGE INCLUDING CARRIER FRAME
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Patent #:
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Issue Dt:
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01/27/2004
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Application #:
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10121215
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Filing Dt:
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04/10/2002
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Title:
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SHIELD CAP AND SEMICONDUCTOR PACKAGE INCLUDING SHIELD CAP
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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10122598
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Filing Dt:
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04/15/2002
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Title:
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LEAD FRAME WITH PLATED END LEADS AND RECESSES
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Patent #:
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|
Issue Dt:
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08/16/2005
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Application #:
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10138225
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Filing Dt:
|
05/01/2002
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Title:
|
INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EMBEDDED CONDUCTIVE PATTERNS AND METHOD THEREFOR
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Patent #:
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|
Issue Dt:
|
09/30/2003
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Application #:
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10142222
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Filing Dt:
|
05/09/2002
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING ISOLATED RING STRUCTURE
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|
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Patent #:
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|
Issue Dt:
|
10/19/2004
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Application #:
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10144905
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Filing Dt:
|
05/13/2002
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Title:
|
LASER MODULE AND OPTICAL SUBASSEMBLY
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|
|
Patent #:
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|
Issue Dt:
|
11/30/2004
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Application #:
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10152945
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Filing Dt:
|
05/22/2002
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Publication #:
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|
Pub Dt:
|
01/30/2003
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
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|
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Patent #:
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|
Issue Dt:
|
03/23/2004
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Application #:
|
10161963
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Filing Dt:
|
06/03/2002
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Title:
|
INJECTION MOLDED LENS-BARREL ASSEMBLY AND METHOD FOR FABRICATING LENS-BARREL AND MOUNT ASSEMBLIES
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|
|
Patent #:
|
|
Issue Dt:
|
12/14/2004
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Application #:
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10162953
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Filing Dt:
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06/04/2002
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Publication #:
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|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
10/07/2003
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Application #:
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10171702
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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10/17/2002
| | | | |
Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
|
01/11/2005
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Application #:
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10174603
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Filing Dt:
|
06/19/2002
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Title:
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SAW AND ETCH SINGULATION METHOD FOR A CHIP PACKAGE
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Patent #:
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|
Issue Dt:
|
03/15/2005
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Application #:
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10194557
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Filing Dt:
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07/12/2002
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Title:
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LEADFRAME INCLUDING CORNER LEADS AND SEMICONDUCTOR PACKAGE USING SAME
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|
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Patent #:
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|
Issue Dt:
|
12/14/2004
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Application #:
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10223747
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Filing Dt:
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08/19/2002
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED WIRE CONDUCTORS AND METHOD THEREFOR
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Patent #:
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|
Issue Dt:
|
06/08/2004
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Application #:
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10223749
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Filing Dt:
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08/19/2002
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Title:
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INTEGRATED CIRCUIT HAVING MULTIPLE POWER/GROUND CONNECTIONS TO A SINGLE EXTERNAL TERMINAL AND METHOD THEREFOR
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Patent #:
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|
Issue Dt:
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11/18/2003
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Application #:
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10224864
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Filing Dt:
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08/20/2002
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Publication #:
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Pub Dt:
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12/26/2002
| | | | |
Title:
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METHOD OF MAKING A SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES
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Patent #:
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|
Issue Dt:
|
11/11/2003
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Application #:
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10227054
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Filing Dt:
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08/23/2002
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Title:
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OPTIC SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10235135
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Filing Dt:
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09/03/2002
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Title:
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LAMINATED LOW-PROFILE DUAL FILTER MODULE FOR TELECOMMUNICATIONS DEVICES AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10237293
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Filing Dt:
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09/09/2002
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Title:
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EXPOSED LEAD QFP PACKAGE FABRICATED THROUGH THE USE OF A PARTIAL SAW PROCESS
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10245071
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Filing Dt:
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09/17/2002
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Title:
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COMPACT FLASH MEMORY CARD WITH CLAMSHELL LEADFRAME
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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10251410
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Filing Dt:
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09/20/2002
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Title:
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LEAD-FRAME METHOD AND CIRCUIT MODULE ASSEMBLY INCLUDING EDGE STIFFENER
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10256905
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Filing Dt:
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09/26/2002
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Publication #:
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Pub Dt:
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04/24/2003
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Title:
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SEMICONDUCTOR DEVICE INCLUDING METAL STRAP ELECTRICALLY COUPLED BETWEEN SEMICONDUCTOR DIE AND METAL LEADFRAME
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Patent #:
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Issue Dt:
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06/28/2005
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Application #:
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10266329
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Filing Dt:
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10/08/2002
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Title:
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DIE DOWN MULTI-MEDIA CARD AND METHOD OF MAKING SAME
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Patent #:
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|
Issue Dt:
|
01/11/2005
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Application #:
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10285978
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Filing Dt:
|
11/01/2002
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Title:
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WAFER-LEVEL CHIP-SCALE PACKAGE
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Patent #:
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Issue Dt:
|
09/20/2005
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Application #:
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10286269
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Filing Dt:
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10/31/2002
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Publication #:
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Pub Dt:
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03/27/2003
| | | | |
Title:
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METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE
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Patent #:
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Issue Dt:
|
09/14/2004
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Application #:
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10286589
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Filing Dt:
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10/31/2002
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Publication #:
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Pub Dt:
|
03/27/2003
| | | | |
Title:
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IMAGE SENSOR PACKAGE
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Patent #:
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Issue Dt:
|
06/14/2005
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Application #:
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10291050
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Filing Dt:
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11/08/2002
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
|
04/06/2004
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Application #:
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10306627
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Filing Dt:
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11/26/2002
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Publication #:
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Pub Dt:
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05/29/2003
| | | | |
Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
09/28/2004
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Application #:
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10329620
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Filing Dt:
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12/26/2002
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Title:
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PRE-MOLDED LEADFRAME
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10340256
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Filing Dt:
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01/10/2003
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Title:
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MOUNTING FOR A PACKAGE CONTAINING A CHIP
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Patent #:
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Issue Dt:
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12/21/2004
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Application #:
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10354772
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Filing Dt:
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01/30/2003
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Title:
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INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
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Patent #:
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Issue Dt:
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04/20/2004
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Application #:
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10356046
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Filing Dt:
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01/31/2003
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Publication #:
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Pub Dt:
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06/19/2003
| | | | |
Title:
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METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP
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Patent #:
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Issue Dt:
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01/25/2005
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Application #:
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10358621
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Filing Dt:
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02/05/2003
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Title:
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OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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10370013
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Filing Dt:
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02/19/2003
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Title:
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STACKING STRUCTURE FOR SEMICONDUCTOR DEVICES USING A FOLDED OVER FLEXIBLE SUBSTRATE AND METHOD THEREFOR
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|
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Patent #:
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Issue Dt:
|
06/15/2004
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Application #:
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10376988
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Filing Dt:
|
02/28/2003
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Title:
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SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING
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Patent #:
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|
Issue Dt:
|
08/09/2005
|
Application #:
|
10383504
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Filing Dt:
|
03/07/2003
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Title:
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SEMICONDUCTOR PACKAGE EXHIBITING EFFICIENT LEAD PLACEMENT
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|
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Patent #:
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Issue Dt:
|
09/21/2004
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Application #:
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10387801
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Filing Dt:
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03/13/2003
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Title:
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LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10392738
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Filing Dt:
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03/19/2003
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING LAMINATED LASER-EMBEDDED CIRCUIT LAYERS
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10420977
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Filing Dt:
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04/22/2003
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Title:
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SEMICONDUCTOR PACKAGE USING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/12/2004
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Application #:
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10423702
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Filing Dt:
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04/25/2003
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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WIRE BONDING METHOD FOR A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/21/2004
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Application #:
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10425134
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Filing Dt:
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04/28/2003
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Title:
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THIN PROFILE SEMICONDUCTOR PACKAGE WHICH REDUCES WARPAGE AND DAMAGE DURING LASER MARKINGS
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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10427118
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Filing Dt:
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05/01/2003
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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10427610
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Filing Dt:
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04/30/2003
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Publication #:
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Pub Dt:
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11/06/2003
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Title:
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SHEET RESIN COMPOSITION AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE THEREWITH
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10435888
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Filing Dt:
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05/12/2003
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Title:
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SEMICONDUCTOR PACKAGE HAVING MORE RELIABLE ELECTRICAL CONDUCTIVE PATTERNS
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Patent #:
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Issue Dt:
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05/03/2005
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Application #:
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10437749
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Filing Dt:
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05/14/2003
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Publication #:
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Pub Dt:
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11/27/2003
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Title:
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COLOR CONTACTS FOR A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/05/2005
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Application #:
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10447012
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Filing Dt:
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05/28/2003
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Title:
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SEMICONDUCTOR PACKAGE WITH INCREASED NUMBER OF INPUT AND OUTPUT PINS
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Patent #:
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Issue Dt:
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05/24/2005
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Application #:
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10459097
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Filing Dt:
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06/11/2003
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Title:
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FULLY-MOLDED LEADFRAME STAND-OFF FEATURE
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10610016
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Filing Dt:
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06/30/2003
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Title:
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THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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06/28/2005
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Application #:
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10614440
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Filing Dt:
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07/03/2003
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Title:
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DOUBLE DOWNSET DOUBLE DAMBAR SUSPENDED LEADFRAME
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10618192
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Filing Dt:
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07/11/2003
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Title:
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POWER SEMICONDUCTOR PACKAGE WITH STRAP
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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10669820
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Filing Dt:
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09/24/2003
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Publication #:
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Pub Dt:
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03/24/2005
| | | | |
Title:
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REINFORCED DIE PAD SUPPORT STRUCTURE
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10672886
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Filing Dt:
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09/26/2003
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE REDUCING WARPAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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01/25/2005
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Application #:
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10680280
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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04/08/2004
| | | | |
Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10688710
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Filing Dt:
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10/17/2003
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10705194
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Filing Dt:
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11/10/2003
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Title:
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STACKED SEMICONDUCTOR DIE ASSEMBLY HAVING AT LEAST ONE SUPPORT
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10771072
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Filing Dt:
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02/02/2004
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Title:
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STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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01/18/2005
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Application #:
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10781220
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Filing Dt:
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02/18/2004
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Title:
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LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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09/20/2005
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Application #:
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10831505
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Filing Dt:
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04/22/2004
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Title:
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SEMICONDUCTOR PACKAGE HAVING ONE OR MORE DIE STACKED ON A PREPACKAGED DEVICE AND METHOD THEREFOR
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