Patent Assignment Details
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Reel/Frame: | 040454/0631 | |
| Pages: | 2 |
| | Recorded: | 11/29/2016 | | |
Attorney Dkt #: | RF50201RC-US01 (038.0692) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/16/2018
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Application #:
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15363671
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Filing Dt:
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11/29/2016
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Publication #:
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Pub Dt:
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05/31/2018
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Title:
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MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTURES AND METHODS FOR THE FABRICATION THEREOF
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Assignee
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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NXP USA, INC. LAW DEPARTMENT
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6501 WILLIAM CANNON DRIVE WEST TX30/OE62
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AUSTIN, TX 78735
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