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Reel/Frame:027573/0633   Pages: 2
Recorded: 01/23/2012
Attorney Dkt #:119520.013600
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/29/2014
Application #:
13299556
Filing Dt:
11/18/2011
Publication #:
Pub Dt:
05/23/2013
Title:
UNDER BUMP PASSIVE COMPONENTS IN WAFER LEVEL PACKAGING
Assignor
1
Exec Dt:
11/24/2011
Assignee
1
CAMBRIDGE BUSINESS PARK, COWLEY ROAD
CHURCHILL HOUSE
CAMBRIDGE, UNITED KINGDOM CB4 OWZ
Correspondence name and address
GARY R. JAROSIK
77 W. WACKER DRIVE
GREENBERG TRAURIG, LLP - SUITE 3100
CHICAGO, IL 60601-1732

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