Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 047613/0633 | |
| Pages: | 7 |
| | Recorded: | 11/28/2018 | | |
| Attorney Dkt #: | 010829-9116.US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2020
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Application #:
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16203538
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Filing Dt:
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11/28/2018
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Publication #:
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Pub Dt:
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04/11/2019
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Title:
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SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS AND METHODS
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Assignee
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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05/31/2024 08:48 AM
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