Patent Assignment Details
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Reel/Frame: | 030879/0635 | |
| Pages: | 4 |
| | Recorded: | 07/25/2013 | | |
Attorney Dkt #: | 01330-US-DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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13951132
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Filing Dt:
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07/25/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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MULTI-CHIP PACKAGE WITH OFFSET DIE STACKING AND METHOD OF MAKING SAME
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Assignee
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11 HINES ROAD, SUITE 203 |
OTTAWA, CANADA K2K 2X1 |
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Correspondence name and address
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MOSAID TECHNOLOGIES INCORPORATED
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11 HINES ROAD
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SUITE 203
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OTTAWA, K2K 2X1 CANADA
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