Patent Assignment Details
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| Reel/Frame: | 032969/0639 | |
| Pages: | 5 |
| | Recorded: | 05/27/2014 | | |
| Attorney Dkt #: | 12-MLT-0413 (854263.668) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14288130
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/04/2014
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Title:
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WAFER-LEVEL PACKAGING OF INTEGRATED DEVICES, AND MANUFACTURING METHOD THEREOF
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Assignees
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| INDUSTRIAL CENTER, INDUSTRIES ROAD |
| KIRKOP, MALTA ZRQ 10 |
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Correspondence name and address
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KAREN M. HENCKEL
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701 FIFTH AVENUE, SUITE 5400
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SEATTLE, WA 98104-7092
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