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Reel/Frame:045647/0640   Pages: 5
Recorded: 04/26/2018
Attorney Dkt #:285628A-3 (GEL8083.359)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/08/2020
Application #:
15963559
Filing Dt:
04/26/2018
Publication #:
Pub Dt:
08/30/2018
Title:
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND METHOD OF MANUFACTURING THEREOF
Assignors
1
Exec Dt:
09/09/2016
2
Exec Dt:
09/09/2016
Assignee
1
1 RIVER ROAD
SCHENECTADY, NEW YORK 12345
Correspondence name and address
ZIOLKOWSKI PATENT SOLUTIONS GROUP, SC
136 SOUTH WISCONSIN STREET
PORT WASHINGTON, WI 53074

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