|
Total properties:
17
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09440751
|
Filing Dt:
|
11/16/1999
|
|
Title:
|
WAFER LEVEL INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09574361
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
CHIP ASSEMBLY WITH INTEGRATED POWER DISTRIBUTION BETWEEN A WAFER INTERPOSER AND AN INTEGRATED CIRCUIT CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2004
|
Application #:
|
09628531
|
Filing Dt:
|
07/31/2000
|
|
Title:
|
METHOD FOR MANUFACTURING A WAFER-INTERPOSER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2003
|
Application #:
|
09629309
|
Filing Dt:
|
07/31/2000
|
|
Title:
|
METHOD FOR SELECTING COMPONENTS FOR A MATCHED SET USING A MULTI WAFER INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
09629326
|
Filing Dt:
|
07/31/2000
|
|
Title:
|
METHOD FOR TESTING MULTIPLE SEMICONDUCTOR WAFERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09659152
|
Filing Dt:
|
09/11/2000
|
|
Title:
|
METHOD FOR SELECTING COMPONENTS FOR A MATCHED SET USING WAFER INTERPOSERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
09678163
|
Filing Dt:
|
10/02/2000
|
|
Title:
|
METHOD FOR SELECTING COMPONENTS FOR A MATCHED SET FROM A WAFER-INTERPOSER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
09707873
|
Filing Dt:
|
11/07/2000
|
|
Title:
|
INTERPOSER FOR IMPROVED HANDLING OF SEMICONDUCTOR WAFERS AND METHOD OF USE OF SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09737925
|
Filing Dt:
|
12/15/2000
|
|
Publication #:
|
|
Pub Dt:
|
06/20/2002
| | | | |
|
Title:
|
WAFER TESTING INTERPOSER FOR A CONVENTIONAL PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2003
|
Application #:
|
09738228
|
Filing Dt:
|
12/15/2000
|
|
Publication #:
|
|
Pub Dt:
|
06/20/2002
| | | | |
|
Title:
|
METHOD FOR BUILDING AN INTERPOSER ONTO A SEMICONDUCTOR WAFER USING LASER TECHNIQUES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/06/2004
|
Application #:
|
09792257
|
Filing Dt:
|
02/23/2001
|
|
Publication #:
|
|
Pub Dt:
|
08/29/2002
| | | | |
|
Title:
|
WAFER-INTERPOSER USING A CERAMIC SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10106167
|
Filing Dt:
|
03/26/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/25/2002
| | | | |
|
Title:
|
WAFER LEVEL INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2004
|
Application #:
|
10371013
|
Filing Dt:
|
02/20/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/10/2003
| | | | |
|
Title:
|
MATCHED SET OF INTEGRATED CIRCUIT CHIPS SELECTED FROM A MULTI WAFER INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2005
|
Application #:
|
10373413
|
Filing Dt:
|
02/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/07/2003
| | | | |
|
Title:
|
WAFER INTERPOSER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2006
|
Application #:
|
10373414
|
Filing Dt:
|
02/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/10/2003
| | | | |
|
Title:
|
METHOD FOR PRODUCING A WAFER INTERPOSER FOR USE IN A WAFER INTERPOSER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2005
|
Application #:
|
10771796
|
Filing Dt:
|
02/02/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
|
Title:
|
METHOD FOR CONSTRUCTING A WAFER-INTERPOSER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2005
|
Application #:
|
10772951
|
Filing Dt:
|
02/05/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
WAFER-INTERPOSER ASSEMBLY
|
|
