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Reel/Frame:044638/0641   Pages: 7
Recorded: 11/01/2017
Attorney Dkt #:1012-2008/2015P51762 US01
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA NAME PREVIOUSLY RECORDED AT REEL: 043490 FRAME: 0037. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
Issue Dt:
08/20/2019
Application #:
15695526
Filing Dt:
09/05/2017
Publication #:
Pub Dt:
02/15/2018
Title:
Methods of Forming Substrate Structures and Semiconductor Components
Assignors
1
Exec Dt:
03/16/2016
2
Exec Dt:
03/08/2016
3
Exec Dt:
03/14/2016
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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