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Total properties:
12
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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13523116
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Filing Dt:
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06/14/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Title:
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MULTILAYER ELECTRONIC STRUCTURE WITH STEPPED HOLES
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13531948
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Filing Dt:
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06/25/2012
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Publication #:
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Pub Dt:
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12/26/2013
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Title:
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ALIGNMENT BETWEEN LAYERS OF MULTILAYER ELECTRONIC SUPPORT STRUCTURES
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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13555437
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Filing Dt:
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07/23/2012
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Publication #:
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Pub Dt:
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01/23/2014
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Title:
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MULTILAYER ELECTRONIC SUPPORT STRUCTURE WITH INTEGRAL CONSTRUCTIONAL ELEMENTS
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13652122
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Filing Dt:
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10/15/2012
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Publication #:
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Pub Dt:
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04/17/2014
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Title:
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METHOD OF FABRICATION, A MULTILAYER ELECTRONIC STRUCTURE AND STRUCTURES IN ACCORDANCE WITH THE METHOD
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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13713550
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Filing Dt:
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12/13/2012
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Publication #:
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Pub Dt:
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06/19/2014
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Title:
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SINGLE LAYER CORELESS SUBSTRATE
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13912652
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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12/11/2014
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Title:
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Novel Terminations and Couplings Between Chips and Substrates
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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13962075
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Filing Dt:
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08/08/2013
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Publication #:
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Pub Dt:
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02/12/2015
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Title:
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Thin Film Capacitors Embedded in Polymer Dielectric
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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13962316
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Filing Dt:
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08/08/2013
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Publication #:
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Pub Dt:
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02/12/2015
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Title:
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Multilayer Electronic Structures with Embedded Filters
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14163084
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Filing Dt:
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01/24/2014
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Publication #:
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Pub Dt:
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07/30/2015
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Title:
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COMPOSITE ELECTRONIC STRUCTURE WITH PARTIALLY EXPOSED AND PROTRUDING COPPER TERMINATION POSTS
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Patent #:
|
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Issue Dt:
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02/03/2015
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Application #:
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14485948
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Filing Dt:
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09/15/2014
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Publication #:
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Pub Dt:
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12/25/2014
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Title:
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Single Layer Coreless Substrate
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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15622733
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Filing Dt:
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06/14/2017
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Publication #:
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Pub Dt:
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12/28/2017
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Title:
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Substrates with Ultra Fine Pitch Flip Chip Bumps
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Patent #:
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Issue Dt:
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03/19/2019
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Application #:
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15950886
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Filing Dt:
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04/11/2018
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Publication #:
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Pub Dt:
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12/20/2018
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Title:
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MULTILAYER ELECTRONIC STRUCTURES WITH EMBEDDED FILTERS
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