Patent Assignment Details
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Reel/Frame: | 014075/0644 | |
| Pages: | 3 |
| | Recorded: | 04/28/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10425894
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
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Assignee
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ONE SPACE PARK |
REDONDO BEACH, CALIFORNIA 90278 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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G. GREGORY SCHIVLEY
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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