Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 028527/0645 | |
| Pages: | 4 |
| | Recorded: | 07/11/2012 | | |
Attorney Dkt #: | T5057-729 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13435702
|
Filing Dt:
|
03/30/2012
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
|
|
Assignee
|
|
|
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 300 |
|
Correspondence name and address
|
|
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
|
|
1700 DIAGONAL ROAD, SUITE 300
|
|
ALEXANDRIA, VA 22314
|
Search Results as of:
06/04/2024 03:54 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|