Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 029701/0647 | |
| Pages: | 8 |
| | Recorded: | 01/28/2013 | | |
Attorney Dkt #: | P51720US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13751207
|
Filing Dt:
|
01/28/2013
|
Publication #:
|
|
Pub Dt:
|
07/31/2014
| | | | |
Title:
|
CHIP ARRANGEMENT AND CHIP PACKAGE HAVING A FIRST LEADFRAME PORTION AND A SECOND LEADFRAME PORTION
|
|
Assignee
|
|
|
SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
|
Correspondence name and address
|
|
VIERING, JENTSCHURA & PARTNER - INF
|
|
3770 HIGHLAND AVE.
|
|
SUITE 203
|
|
MANHATTAN BEACH, CA 90266
|
Search Results as of:
06/05/2024 04:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|