Patent Assignment Details
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| Reel/Frame: | 031731/0647 | |
| Pages: | 5 |
| | Recorded: | 12/06/2013 | | |
| Attorney Dkt #: | 81495389US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/2016
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Application #:
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14098923
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Filing Dt:
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12/06/2013
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Publication #:
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Pub Dt:
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06/19/2014
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Title:
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METHOD OF PROCESSING A SILICON WAFER AND A SILICON INTEGRATED CIRCUIT
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Assignee
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS NL-5656 AG |
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Correspondence name and address
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NXP INTELLECTUAL PROPERTY AND LICENSING
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411 EAST PLUMERIA DRIVE
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MS41
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SAN JOSE, CA 95134
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