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Reel/Frame:060934/0648   Pages: 3
Recorded: 08/30/2022
Attorney Dkt #:44019438CIP
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/19/2024
Application #:
17513631
Filing Dt:
10/28/2021
Publication #:
Pub Dt:
08/18/2022
Title:
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS
Assignor
1
Exec Dt:
08/26/2022
Assignee
1
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
MOSER TABOADA/ALAN TABOADA
1040 BROAD STREET
SUITE 103
SHREWSBURY, NJ 07702

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