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Patent Assignment Details

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Reel/Frame:	017600/0649			Pages:	5
		Recorded:	05/11/2006
Attorney Dkt #:	ASSIGNMETS (MEG TO MGC)
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 30

Patent #:	6399975	Issue Dt:	06/04/2002	Application #:	09801327	Filing Dt:	03/07/2001
Title:	WIDE BIT MEMORY USING POST PASSIVATION INTERCONNECTION SCHEME

Patent #:	6800941	Issue Dt:	10/05/2004	Application #:	10055498	Filing Dt:	01/22/2002
Publication #:	US20030124767	Pub Dt:	07/03/2003
Title:	INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent #:	7413929	Issue Dt:	08/19/2008	Application #:	10055499	Filing Dt:	01/22/2002
Publication #:	US20030122243	Pub Dt:	07/03/2003
Title:	INTEGRATED CHIP PACKAGE STRUCTURE USING ORGANIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent #:	8119446	Issue Dt:	02/21/2012	Application #:	10055560	Filing Dt:	01/22/2002
Publication #:	US20030122244	Pub Dt:	07/03/2003
Title:	INTEGRATED CHIP PACKAGE STRUCTURE USING METAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent #:	9030029	Issue Dt:	05/12/2015	Application #:	10055568	Filing Dt:	01/22/2002
Publication #:	US20030122246	Pub Dt:	07/03/2003
Title:	CHIP PACKAGE WITH DIE AND SUBSTRATE

Patent #:	NONE	Issue Dt:		Application #:	10055580	Filing Dt:	01/22/2002
Publication #:	US20030127734	Pub Dt:	07/10/2003
Title:	Semiconductor device with metal pillar

Patent #:	6756295	Issue Dt:	06/29/2004	Application #:	10124388	Filing Dt:	04/15/2002
Publication #:	US20020109232	Pub Dt:	08/15/2002
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	6762115	Issue Dt:	07/13/2004	Application #:	10125226	Filing Dt:	04/16/2002
Publication #:	US20020115282	Pub Dt:	08/22/2002
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	6784087	Issue Dt:	08/31/2004	Application #:	10174357	Filing Dt:	06/17/2002
Publication #:	US20030129822	Pub Dt:	07/10/2003
Title:	METHOD OF FABRICATING CYLINDRICAL BONDING STRUCTURE

Patent #:	6746898	Issue Dt:	06/08/2004	Application #:	10174462	Filing Dt:	06/17/2002
Publication #:	US20030124835	Pub Dt:	07/03/2003
Title:	INTEGRATED CHIP PACKAGE STRUCTURE USING SILICON SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent #:	6798073	Issue Dt:	09/28/2004	Application #:	10337668	Filing Dt:	01/06/2003
Publication #:	US20030111711	Pub Dt:	06/19/2003
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	6700162	Issue Dt:	03/02/2004	Application #:	10337673	Filing Dt:	01/06/2003
Publication #:	US20030107136	Pub Dt:	06/12/2003
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	8211791	Issue Dt:	07/03/2012	Application #:	10382699	Filing Dt:	03/05/2003
Publication #:	US20030148604	Pub Dt:	08/07/2003
Title:	METHOD FOR FABRICATING CIRCUITRY COMPONENT

Patent #:	8535976	Issue Dt:	09/17/2013	Application #:	10454972	Filing Dt:	06/04/2003
Publication #:	US20030205804	Pub Dt:	11/06/2003
Title:	METHOD FOR FABRICATING CHIP PACKAGE WITH DIE AND SUBSTRATE

Patent #:	7511376	Issue Dt:	03/31/2009	Application #:	10638018	Filing Dt:	08/08/2003
Publication #:	US20040046254	Pub Dt:	03/11/2004
Title:	CIRCUITRY COMPONENT WITH METAL LAYER OVER DIE AND EXTENDING TO PLACE NOT OVER DIE

Patent #:	6936531	Issue Dt:	08/30/2005	Application #:	10690250	Filing Dt:	10/20/2003
Publication #:	US20040079966	Pub Dt:	04/29/2004
Title:	PROCESS OF FABRICATING A CHIP STRUCTURE

Patent #:	7242099	Issue Dt:	07/10/2007	Application #:	10695630	Filing Dt:	10/27/2003
Publication #:	US20040126927	Pub Dt:	07/01/2004
Title:	CHIP PACKAGE WITH MULTIPLE CHIPS CONNECTED BY BUMPS

Patent #:	8421158	Issue Dt:	04/16/2013	Application #:	10710596	Filing Dt:	07/23/2004
Publication #:	US20040245580	Pub Dt:	12/09/2004
Title:	CHIP STRUCTURE WITH A PASSIVE DEVICE AND METHOD FOR FORMING THE SAME

Patent #:	7345365	Issue Dt:	03/18/2008	Application #:	10728150	Filing Dt:	12/03/2003
Publication #:	US20040119097	Pub Dt:	06/24/2004
Title:	ELECTRONIC COMPONENT WITH DIE AND PASSIVE DEVICE

Patent #:	7394161	Issue Dt:	07/01/2008	Application #:	10730834	Filing Dt:	12/08/2003
Publication #:	US20050121804	Pub Dt:	06/09/2005
Title:	CHIP STRUCTURE WITH PADS HAVING BUMPS OR WIREBONDED WIRES FORMED THEREOVER OR USED TO BE TESTED THERETO

Patent #:	9136246	Issue Dt:	09/15/2015	Application #:	10755042	Filing Dt:	01/09/2004
Publication #:	US20040140556	Pub Dt:	07/22/2004
Title:	INTEGRATED CHIP PACKAGE STRUCTURE USING SILICON SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent #:	7297614	Issue Dt:	11/20/2007	Application #:	10794472	Filing Dt:	03/05/2004
Publication #:	US20040169264	Pub Dt:	09/02/2004
Title:	METHOD FOR FABRICATING CIRCUITRY COMPONENT

Patent #:	7208834	Issue Dt:	04/24/2007	Application #:	10874704	Filing Dt:	06/22/2004
Publication #:	US20050026413	Pub Dt:	02/03/2005
Title:	BONDING STRUCTURE WITH PILLAR AND CAP

Patent #:	NONE	Issue Dt:		Application #:	10933961	Filing Dt:	09/02/2004
Publication #:	US20050032351	Pub Dt:	02/10/2005
Title:	METHOD FOR FABRICATING CIRCUITRY COMPONENT

Patent #:	7271033	Issue Dt:	09/18/2007	Application #:	10977289	Filing Dt:	10/28/2004
Publication #:	US20050121771	Pub Dt:	06/09/2005
Title:	METHOD FOR FABRICATING CHIP PACKAGE

Patent #:	7470988	Issue Dt:	12/30/2008	Application #:	10997145	Filing Dt:	11/24/2004
Publication #:	US20050087844	Pub Dt:	04/28/2005
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	7382005	Issue Dt:	06/03/2008	Application #:	11123328	Filing Dt:	05/06/2005
Publication #:	US20050194695	Pub Dt:	09/08/2005
Title:	CIRCUIT COMPONENT WITH BUMP FORMED OVER CHIP

Patent #:	7309920	Issue Dt:	12/18/2007	Application #:	11123936	Filing Dt:	05/06/2005
Publication #:	US20050263893	Pub Dt:	12/01/2005
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	8232192	Issue Dt:	07/31/2012	Application #:	11124493	Filing Dt:	05/05/2005
Publication #:	US20050266670	Pub Dt:	12/01/2005
Title:	PROCESS OF BONDING CIRCUITRY COMPONENTS

Patent #:	8294279	Issue Dt:	10/23/2012	Application #:	11307127	Filing Dt:	01/24/2006
Publication #:	US20060220259	Pub Dt:	10/05/2006
Title:	CHIP PACKAGE WITH DAM BAR RESTRICTING FLOW OF UNDERFILL

Assignor

Exec Dt:

04/28/2006

Assignee

ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK

HSINCHU, TAIWAN

Correspondence name and address
	WINSTON HSU
	P.O.BOX 506
	MERRIFIELD, VA 22116

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