Patent Assignment Details
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| Reel/Frame: | 060394/0650 | |
| Pages: | 5 |
| | Recorded: | 07/04/2022 | | |
| Attorney Dkt #: | 252011-7841 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17810626
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Filing Dt:
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07/04/2022
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Publication #:
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Pub Dt:
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11/03/2022
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Title:
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PACKAGE STRUCTURE WITH FAN-OUT STRUCTURE
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Assignee
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK LLP
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280 INTERSTATE NORTH CIRCLE
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SUITE 550
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ATLANTA, GA 30339
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06/04/2024 05:03 AM
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