Patent Assignment Details
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| Reel/Frame: | 013583/0652 | |
| Pages: | 3 |
| | Recorded: | 12/17/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10320485
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Filing Dt:
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12/17/2002
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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MOLDING APPARATUS FOR MOLDING SEMICONDUCTOR DEVICES IN WHICH THE MOLD IS AUTOMATICALLY TREATED WITH A RELEASING AGENT
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Assignee
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| 416, MAETAN-DONG, PALDAL-GU |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY, & PIERCE, PLC
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JOHN A. CASTELLANO
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P.O. BOX 8910
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RESTON, VA 20195
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