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Patent Assignment Details
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Reel/Frame:055650/0654   Pages: 43
Recorded: 03/18/2021
Attorney Dkt #:28915US04
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/07/2023
Application #:
17086633
Filing Dt:
11/02/2020
Publication #:
Pub Dt:
02/18/2021
Title:
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
Assignor
1
Exec Dt:
11/19/2019
Assignee
1
491 B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondence name and address
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
SUITE 3400
CHICAGO, IL 60661

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