Patent Assignment Details
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| Reel/Frame: | 061385/0658 | |
| Pages: | 6 |
| | Recorded: | 09/06/2022 | | |
| Attorney Dkt #: | PT22-032 CN/PCT/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17909146
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Filing Dt:
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09/02/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Title:
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DIE BONDING METHOD FOR MICRO-LED
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Assignee
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| BLDG 8, BLOCK 2, BAIMANG BAIWANGXIN INDUSTRIAL PRK |
| XILI AREA, NANSHAN DISTRICT SHENZHEN |
| GUANGDONG, CHINA 518108 |
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Correspondence name and address
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DENTONS COHEN & GRIGSBY P.C.
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625 LIBERTY AVENUE
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PITTSBURGH, PA 15222
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05/26/2024 04:36 AM
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