Patent Assignment Details
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Reel/Frame: | 014728/0660 | |
| Pages: | 4 |
| | Recorded: | 11/25/2003 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS. DOCUMENT PREVIOUSLY RECORDED ON REEL 014126 FRAME 0003, ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2006
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Application #:
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10446275
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Filing Dt:
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05/23/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Title:
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MOISTURE RESISTANT INTEGRATED CIRCUIT LEADFRAME PACKAGE
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Assignee
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5 YISHUN ST. 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94067
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