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Reel/Frame:	062119/0661			Pages:	13
		Recorded:	12/14/2022
Attorney Dkt #:	252319-9010
Conveyance:	MERGER (SEE DOCUMENT FOR DETAILS).

Total properties: 64

Patent #:	6649834	Issue Dt:	11/18/2003	Application #:	10321917	Filing Dt:	12/16/2002
Title:	INJECTION MOLDED IMAGE SENSOR AND A METHOD FOR MANUFACTURING THE SAME

Patent #:	6740973	Issue Dt:	05/25/2004	Application #:	10340361	Filing Dt:	01/09/2003
Title:	STACKED STRUCTURE FOR AN IMAGE SENSOR

Patent #:	7250324	Issue Dt:	07/31/2007	Application #:	10386067	Filing Dt:	03/10/2003
Publication #:	US20040179126	Pub Dt:	09/16/2004
Title:	METHOD FOR MANUFACTURING AN IMAGE SENSOR

Patent #:	7440263	Issue Dt:	10/21/2008	Application #:	10621963	Filing Dt:	07/16/2003
Publication #:	US20050013098	Pub Dt:	01/20/2005
Title:	IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6906397	Issue Dt:	06/14/2005	Application #:	10621992	Filing Dt:	07/16/2003
Publication #:	US20050012170	Pub Dt:	01/20/2005
Title:	IMAGE SENSOR HAVING AN IMPROVED TRANSPARENT LAYER

Patent #:	7345360	Issue Dt:	03/18/2008	Application #:	10705379	Filing Dt:	11/10/2003
Publication #:	US20050099531	Pub Dt:	05/12/2005
Title:	MULTIPLE CHIPS IMAGE SENSOR PACKAGE

Patent #:	7064404	Issue Dt:	06/20/2006	Application #:	11052990	Filing Dt:	02/07/2005
Title:	IMAGE SENSOR STRUCTURE

Patent #:	7169645	Issue Dt:	01/30/2007	Application #:	11118498	Filing Dt:	04/29/2005
Publication #:	US20050191787	Pub Dt:	09/01/2005
Title:	METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES

Patent #:	7387902	Issue Dt:	06/17/2008	Application #:	11250356	Filing Dt:	10/15/2005
Publication #:	US20060046351	Pub Dt:	03/02/2006
Title:	METHODS FOR PACKAGING IMAGE SENSITIVE ELECTRONIC DEVICES

Patent #:	7423334	Issue Dt:	09/09/2008	Application #:	11283596	Filing Dt:	11/17/2005
Publication #:	US20070108577	Pub Dt:	05/17/2007
Title:	IMAGE SENSOR MODULE WITH A PROTECTION LAYER AND A METHOD FOR MANUFACTURING THE SAME

Patent #:	7554599	Issue Dt:	06/30/2009	Application #:	11367867	Filing Dt:	03/02/2006
Publication #:	US20070206109	Pub Dt:	09/06/2007
Title:	IMAGE SENSOR MODULE WITH AIR ESCAPE HOLE AND A METHOD FOR MANUFACTURING THE SAME

Patent #:	7402839	Issue Dt:	07/22/2008	Application #:	11378794	Filing Dt:	03/16/2006
Publication #:	US20070215972	Pub Dt:	09/20/2007
Title:	IMAGE SENSOR PACKAGE STRUCTURE

Patent #:	8008762	Issue Dt:	08/30/2011	Application #:	11646991	Filing Dt:	12/28/2006
Publication #:	US20070108579	Pub Dt:	05/17/2007
Title:	METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR

Patent #:	8847146	Issue Dt:	09/30/2014	Application #:	12579493	Filing Dt:	10/15/2009
Publication #:	US20110024610	Pub Dt:	02/03/2011
Title:	IMAGE SENSOR PACKAGE STRUCTURE WITH CASING INCLUDING A VENT WITHOUT SEALING AND IN COMMUNICATION WITH PACKAGE MATERIAL

Patent #:	8093674	Issue Dt:	01/10/2012	Application #:	12603591	Filing Dt:	10/22/2009
Publication #:	US20110024861	Pub Dt:	02/03/2011
Title:	MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND IMAGE SENSOR PACKAGE STRUCTURE THEREOF

Patent #:	8390087	Issue Dt:	03/05/2013	Application #:	12683546	Filing Dt:	01/07/2010
Publication #:	US20110024862	Pub Dt:	02/03/2011
Title:	IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY

Patent #:	8563350	Issue Dt:	10/22/2013	Application #:	12947316	Filing Dt:	11/16/2010
Publication #:	US20110291215	Pub Dt:	12/01/2011
Title:	WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Patent #:	8928104	Issue Dt:	01/06/2015	Application #:	12947970	Filing Dt:	11/17/2010
Publication #:	US20110156188	Pub Dt:	06/30/2011
Title:	IMAGE SENSOR PACKAGING STRUCTURE WITH BLACK ENCAPSULANT

Patent #:	8440488	Issue Dt:	05/14/2013	Application #:	12948020	Filing Dt:	11/17/2010
Publication #:	US20110279815	Pub Dt:	11/17/2011
Title:	MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH

Patent #:	8481343	Issue Dt:	07/09/2013	Application #:	12961521	Filing Dt:	12/07/2010
Publication #:	US20120068288	Pub Dt:	03/22/2012
Title:	MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH AND THE STRUCTURE USING THE SAME

Patent #:	8828777	Issue Dt:	09/09/2014	Application #:	13012967	Filing Dt:	01/25/2011
Publication #:	US20110241147	Pub Dt:	10/06/2011
Title:	WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME

Patent #:	8426954	Issue Dt:	04/23/2013	Application #:	13212579	Filing Dt:	08/18/2011
Publication #:	US20110298077	Pub Dt:	12/08/2011
Title:	METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR

Patent #:	9184331	Issue Dt:	11/10/2015	Application #:	13766568	Filing Dt:	02/13/2013
Publication #:	US20130149805	Pub Dt:	06/13/2013
Title:	METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAGE SENSOR

Patent #:	8703519	Issue Dt:	04/22/2014	Application #:	13796622	Filing Dt:	03/12/2013
Publication #:	US20140098287	Pub Dt:	04/10/2014
Title:	STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA MODULE

Patent #:	8969120	Issue Dt:	03/03/2015	Application #:	14053743	Filing Dt:	10/15/2013
Publication #:	US20150011038	Pub Dt:	01/08/2015
Title:	TWO-STAGE PACKAGING METHOD OF IMAGE SENSORS

Patent #:	10170508	Issue Dt:	01/01/2019	Application #:	15623596	Filing Dt:	06/15/2017
Publication #:	US20170365632	Pub Dt:	12/21/2017
Title:	OPTICAL PACKAGE STRUCTURE

Patent #:	10186538	Issue Dt:	01/22/2019	Application #:	15641378	Filing Dt:	07/05/2017
Publication #:	US20180012919	Pub Dt:	01/11/2018
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10236313	Issue Dt:	03/19/2019	Application #:	15641401	Filing Dt:	07/05/2017
Publication #:	US20180012920	Pub Dt:	01/11/2018
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	9905597	Issue Dt:	02/27/2018	Application #:	15647465	Filing Dt:	07/12/2017
Publication #:	US20180019274	Pub Dt:	01/18/2018
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10600829	Issue Dt:	03/24/2020	Application #:	15657301	Filing Dt:	07/24/2017
Publication #:	US20180068912	Pub Dt:	03/08/2018
Title:	PACKAGE BASE CORE AND SENSOR PACKAGE STRUCTURE

Patent #:	10600830	Issue Dt:	03/24/2020	Application #:	15819741	Filing Dt:	11/21/2017
Publication #:	US20190057992	Pub Dt:	02/21/2019
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10411055	Issue Dt:	09/10/2019	Application #:	15907360	Filing Dt:	02/28/2018
Publication #:	US20190074310	Pub Dt:	03/07/2019
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10340250	Issue Dt:	07/02/2019	Application #:	15911574	Filing Dt:	03/05/2018
Publication #:	US20190057952	Pub Dt:	02/21/2019
Title:	STACK TYPE SENSOR PACKAGE STRUCTURE

Patent #:	10727141	Issue Dt:	07/28/2020	Application #:	15942138	Filing Dt:	03/30/2018
Publication #:	US20190164853	Pub Dt:	05/30/2019
Title:	METHOD FOR INSPECTING SENSOR PACKAGE STRUCTURE, INSPECTION APPARATUS, AND FOCUS ASSISTANT LOADER OF INSPECTION APPARATUS

Patent #:	10692917	Issue Dt:	06/23/2020	Application #:	16133874	Filing Dt:	09/18/2018
Publication #:	US20190019834	Pub Dt:	01/17/2019
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10720370	Issue Dt:	07/21/2020	Application #:	16172966	Filing Dt:	10/29/2018
Publication #:	US20190355639	Pub Dt:	11/21/2019
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10700111	Issue Dt:	06/30/2020	Application #:	16294436	Filing Dt:	03/06/2019
Publication #:	US20200098809	Pub Dt:	03/26/2020
Title:	OPTICAL SENSOR

Patent #:	10825851	Issue Dt:	11/03/2020	Application #:	16390280	Filing Dt:	04/22/2019
Publication #:	US20200119070	Pub Dt:	04/16/2020
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	10964615	Issue Dt:	03/30/2021	Application #:	16454143	Filing Dt:	06/27/2019
Publication #:	US20200273766	Pub Dt:	08/27/2020
Title:	CHIP-SCALE SENSOR PACKAGE STRUCTURE

Patent #:	10868062	Issue Dt:	12/15/2020	Application #:	16508431	Filing Dt:	07/11/2019
Publication #:	US20200105809	Pub Dt:	04/02/2020
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	11227885	Issue Dt:	01/18/2022	Application #:	16571764	Filing Dt:	09/16/2019
Publication #:	US20200312898	Pub Dt:	10/01/2020
Title:	IMAGE SENSOR PACKAGE WITH PARTICLE BLOCKING DAM

Patent #:	10804413	Issue Dt:	10/13/2020	Application #:	16729842	Filing Dt:	12/30/2019
Title:	PACKAGE COMPONENT

Patent #:	11133348	Issue Dt:	09/28/2021	Application #:	16744845	Filing Dt:	01/16/2020
Publication #:	US20200350357	Pub Dt:	11/05/2020
Title:	SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF

Patent #:	10916511	Issue Dt:	02/09/2021	Application #:	16784299	Filing Dt:	02/07/2020
Title:	METHOD FOR REDUCING WARPAGE OCCURRED TO SUBSTRATE STRIP AFTER MOLDING PROCESS

Patent #:	11094056	Issue Dt:	08/17/2021	Application #:	16862731	Filing Dt:	04/30/2020
Publication #:	US20210150689	Pub Dt:	05/20/2021
Title:	DEFECT INSPECTION METHOD FOR SENSOR PACKAGE STRUCTURE

Patent #:	11257964	Issue Dt:	02/22/2022	Application #:	16910399	Filing Dt:	06/24/2020
Publication #:	US20210288190	Pub Dt:	09/16/2021
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	16920492	Filing Dt:	07/03/2020
Publication #:	US20210305437	Pub Dt:	09/30/2021
Title:	SENSOR PACKAGE STRUCTURE WITH RING-SHAPED SOLDER MASK FRAME

Patent #:	11552120	Issue Dt:	01/10/2023	Application #:	16928193	Filing Dt:	07/14/2020
Publication #:	US20210305304	Pub Dt:	09/30/2021
Title:	CHIP-SCALE SENSOR PACKAGE STRUCTURE

Patent #:	11309275	Issue Dt:	04/19/2022	Application #:	17038011	Filing Dt:	09/30/2020
Publication #:	US20210398934	Pub Dt:	12/23/2021
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	11735562	Issue Dt:	08/22/2023	Application #:	17205463	Filing Dt:	03/18/2021
Publication #:	US20220254752	Pub Dt:	08/11/2022
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	11776975	Issue Dt:	10/03/2023	Application #:	17468824	Filing Dt:	09/08/2021
Publication #:	US20220328547	Pub Dt:	10/13/2022
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17560176	Filing Dt:	12/22/2021
Publication #:	US20220359593	Pub Dt:	11/10/2022
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17564142	Filing Dt:	12/28/2021
Publication #:	US20230073527	Pub Dt:	03/09/2023
Title:	SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Patent #:	11744010	Issue Dt:	08/29/2023	Application #:	17573588	Filing Dt:	01/11/2022
Publication #:	US20220361321	Pub Dt:	11/10/2022
Title:	SENSOR LENS ASSEMBLY HAVING NON-REFLOW CONFIGURATION

Patent #:	NONE	Issue Dt:		Application #:	17580577	Filing Dt:	01/20/2022
Publication #:	US20220394845	Pub Dt:	12/08/2022
Title:	SENSOR LENS ASSEMBLY HAVING NON-SOLDERING CONFIGURATION

Patent #:	11723147	Issue Dt:	08/08/2023	Application #:	17667486	Filing Dt:	02/08/2022
Publication #:	US20220361327	Pub Dt:	11/10/2022
Title:	SENSOR LENS ASSEMBLY HAVING NON-REFLOW CONFIGURATION

Patent #:	11792497	Issue Dt:	10/17/2023	Application #:	17667625	Filing Dt:	02/09/2022
Publication #:	US20220360692	Pub Dt:	11/10/2022
Title:	SENSOR LENS ASSEMBLY HAVING NON-REFLOW CONFIGURATION

Patent #:	NONE	Issue Dt:		Application #:	17688976	Filing Dt:	03/08/2022
Publication #:	US20220390703	Pub Dt:	12/08/2022
Title:	SENSOR LENS ASSEMBLY HAVING NON-SOLDERING CONFIGURATION

Patent #:	NONE	Issue Dt:		Application #:	17715924	Filing Dt:	04/07/2022
Publication #:	US20230230939	Pub Dt:	07/20/2023
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17717223	Filing Dt:	04/11/2022
Publication #:	US20230207590	Pub Dt:	06/29/2023
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17720398	Filing Dt:	04/14/2022
Publication #:	US20230215896	Pub Dt:	07/06/2023
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17741421	Filing Dt:	05/10/2022
Publication #:	US20230197743	Pub Dt:	06/22/2023
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17749077	Filing Dt:	05/19/2022
Publication #:	US20230238411	Pub Dt:	07/27/2023
Title:	SENSOR PACKAGE STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	17852384	Filing Dt:	06/29/2022
Publication #:	US20230197744	Pub Dt:	06/22/2023
Title:	SENSOR PACKAGE STRUCTURE

Assignor

KINGPAK TECHNOLOGY INC.

Exec Dt:

08/26/2022

Assignee

TONG HSING ELECTRONIC INDUSTRIES, LTD.

6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST.

TAIPEI CITY, TAIWAN 100011

Correspondence name and address
	MCCLURE, QUALEY & RODACK LLP
	280 INTERSTATE NORTH CIRCLE
	SUITE 550
	ATLANTA, GA 30339

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