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Reel/Frame:065957/0661   Pages: 10
Recorded: 12/27/2023
Attorney Dkt #:TW0027-ADL_TSMC
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 43
1
Patent #:
6818475
Issue Dt:
11/16/2004
Application #:
10640539
Filing Dt:
08/13/2003
Publication #:
US20040032026
Pub Dt:
02/19/2004
Title:
WAFER LEVEL PACKAGE AND THE PROCESS OF THE SAME
2
Patent #:
7459781
Issue Dt:
12/02/2008
Application #:
10725933
Filing Dt:
12/03/2003
Publication #:
US20050124093
Pub Dt:
06/09/2005
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
3
Patent #:
7061106
Issue Dt:
06/13/2006
Application #:
10833345
Filing Dt:
04/28/2004
Publication #:
US20050242408
Pub Dt:
11/03/2005
Title:
STRUCTURE OF IMAGE SENSOR MODULE AND A METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
4
Patent #:
7259468
Issue Dt:
08/21/2007
Application #:
10835571
Filing Dt:
04/30/2004
Publication #:
US20050242418
Pub Dt:
11/03/2005
Title:
STRUCTURE OF PACKAGE
5
Patent #:
7224061
Issue Dt:
05/29/2007
Application #:
10918416
Filing Dt:
08/16/2004
Publication #:
US20060033196
Pub Dt:
02/16/2006
Title:
PACKAGE STRUCTURE
6
Patent #:
7238602
Issue Dt:
07/03/2007
Application #:
10973557
Filing Dt:
10/26/2004
Publication #:
US20060087036
Pub Dt:
04/27/2006
Title:
CHIP-SIZE PACKAGE STRUCTURE AND METHOD OF THE SAME
7
Patent #:
7525139
Issue Dt:
04/28/2009
Application #:
11025746
Filing Dt:
12/29/2004
Publication #:
US20050242409
Pub Dt:
11/03/2005
Title:
IMAGE SENSOR WITH A PROTECTION LAYER
8
Patent #:
7400037
Issue Dt:
07/15/2008
Application #:
11026488
Filing Dt:
12/30/2004
Publication #:
US20060145364
Pub Dt:
07/06/2006
Title:
PACKAGING STRUCTURE WITH COPLANAR FILLING PASTE AND DICE AND WITH PATTERNED GLUE FOR WL-CSP
9
Patent #:
7279782
Issue Dt:
10/09/2007
Application #:
11029929
Filing Dt:
01/05/2005
Publication #:
US20060145325
Pub Dt:
07/06/2006
Title:
FBGA AND COB PACKAGE STRUCTURE FOR IMAGE SENSOR
10
Patent #:
7985626
Issue Dt:
07/26/2011
Application #:
11158167
Filing Dt:
06/20/2005
Publication #:
US20050247398
Pub Dt:
11/10/2005
Title:
MANUFACTURING TOOL FOR WAFER LEVEL PACKAGE AND METHOD OF PLACING DIES
11
Patent #:
7262081
Issue Dt:
08/28/2007
Application #:
11169722
Filing Dt:
06/30/2005
Publication #:
US20050236696
Pub Dt:
10/27/2005
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
12
Patent #:
7176567
Issue Dt:
02/13/2007
Application #:
11175420
Filing Dt:
07/06/2005
Publication #:
US20070007648
Pub Dt:
01/11/2007
Title:
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATING THE SAME
13
Patent #:
7319043
Issue Dt:
01/15/2008
Application #:
11235485
Filing Dt:
09/26/2005
Publication #:
US20070069207
Pub Dt:
03/29/2007
Title:
METHOD AND SYSTEM OF TRACE PULL TEST
14
Patent #:
7196408
Issue Dt:
03/27/2007
Application #:
11301303
Filing Dt:
12/12/2005
Publication #:
US20060091514
Pub Dt:
05/04/2006
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
15
Patent #:
7514767
Issue Dt:
04/07/2009
Application #:
11456141
Filing Dt:
07/07/2006
Publication #:
US20060231958
Pub Dt:
10/19/2006
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
16
Patent #:
7884464
Issue Dt:
02/08/2011
Application #:
11475131
Filing Dt:
06/27/2006
Publication #:
US20070296065
Pub Dt:
12/27/2007
Title:
3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE
17
Patent #:
7498646
Issue Dt:
03/03/2009
Application #:
11488653
Filing Dt:
07/19/2006
Publication #:
US20080017941
Pub Dt:
01/24/2008
Title:
STRUCTURE OF IMAGE SENSOR MODULE AND A METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
18
Patent #:
7416920
Issue Dt:
08/26/2008
Application #:
11538098
Filing Dt:
10/03/2006
Publication #:
US20070082428
Pub Dt:
04/12/2007
Title:
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATING THE SAME
19
Patent #:
7468544
Issue Dt:
12/23/2008
Application #:
11567795
Filing Dt:
12/07/2006
Publication #:
US20080136026
Pub Dt:
06/12/2008
Title:
STRUCTURE AND PROCESS FOR WL-CSP WITH METAL COVER
20
Patent #:
7566854
Issue Dt:
07/28/2009
Application #:
11608254
Filing Dt:
12/08/2006
Publication #:
US20080135728
Pub Dt:
06/12/2008
Title:
IMAGE SENSOR MODULE
21
Patent #:
7459729
Issue Dt:
12/02/2008
Application #:
11647217
Filing Dt:
12/29/2006
Publication #:
US20080157312
Pub Dt:
07/03/2008
Title:
SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
22
Patent #:
7911044
Issue Dt:
03/22/2011
Application #:
11647448
Filing Dt:
12/29/2006
Publication #:
US20080157341
Pub Dt:
07/03/2008
Title:
RF MODULE PACKAGE FOR RELEASING STRESS
23
Patent #:
8178963
Issue Dt:
05/15/2012
Application #:
11648688
Filing Dt:
01/03/2007
Publication #:
US20080157336
Pub Dt:
07/03/2008
Title:
WAFER LEVEL PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
24
Patent #:
7812434
Issue Dt:
10/12/2010
Application #:
11648787
Filing Dt:
01/03/2007
Publication #:
US20080157396
Pub Dt:
07/03/2008
Title:
WAFER LEVEL PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
25
Patent #:
8304923
Issue Dt:
11/06/2012
Application #:
11692933
Filing Dt:
03/29/2007
Publication #:
US20080237834
Pub Dt:
10/02/2008
Title:
CHIP PACKAGING STRUCTURE
26
Patent #:
8178964
Issue Dt:
05/15/2012
Application #:
11694719
Filing Dt:
03/30/2007
Publication #:
US20080237879
Pub Dt:
10/02/2008
Title:
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
27
Patent #:
7498556
Issue Dt:
03/03/2009
Application #:
11725041
Filing Dt:
03/15/2007
Publication #:
US20080224248
Pub Dt:
09/18/2008
Title:
IMAGE SENSOR MODULE HAVING BUILD-IN PACKAGE CAVITY AND THE METHOD OF THE SAME
28
Patent #:
7525185
Issue Dt:
04/28/2009
Application #:
11725827
Filing Dt:
03/19/2007
Publication #:
US20080230884
Pub Dt:
09/25/2008
Title:
SEMICONDUCTOR DEVICE PACKAGE HAVING MULTI-CHIPS WITH SIDE-BY-SIDE CONFIGURATION AND METHOD OF THE SAME
29
Patent #:
7339279
Issue Dt:
03/04/2008
Application #:
11747417
Filing Dt:
05/11/2007
Publication #:
US20070205494
Pub Dt:
09/06/2007
Title:
CHIP-SIZE PACKAGE STRUCTURE AND METHOD OF THE SAME
30
Patent #:
7476565
Issue Dt:
01/13/2009
Application #:
11799923
Filing Dt:
05/03/2007
Publication #:
US20080044945
Pub Dt:
02/21/2008
Title:
METHOD FOR FORMING FILLING PASTE STRUCTURE OF WL PACKAGE
31
Patent #:
7687923
Issue Dt:
03/30/2010
Application #:
11933758
Filing Dt:
11/01/2007
Publication #:
US20090039497
Pub Dt:
02/12/2009
Title:
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
32
Patent #:
7501310
Issue Dt:
03/10/2009
Application #:
11945723
Filing Dt:
11/27/2007
Publication #:
US20080108168
Pub Dt:
05/08/2008
Title:
STRUCTURE OF IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
33
Patent #:
7557437
Issue Dt:
07/07/2009
Application #:
11946424
Filing Dt:
11/28/2007
Publication #:
US20080105967
Pub Dt:
05/08/2008
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
34
Patent #:
7423335
Issue Dt:
09/09/2008
Application #:
11954087
Filing Dt:
12/11/2007
Publication #:
US20080157250
Pub Dt:
07/03/2008
Title:
SENSOR MODULE PACKAGE STRUCTURE AND METHOD OF THE SAME
35
Patent #:
7655501
Issue Dt:
02/02/2010
Application #:
12141138
Filing Dt:
06/18/2008
Publication #:
US20080248614
Pub Dt:
10/09/2008
Title:
WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
36
Patent #:
7763494
Issue Dt:
07/27/2010
Application #:
12216658
Filing Dt:
07/09/2008
Publication #:
US20080274593
Pub Dt:
11/06/2008
Title:
SEMICONDUCTOR DEVICE PACKAGE WITH MULTI-CHIPS AND METHOD OF THE SAME
37
Patent #:
7884461
Issue Dt:
02/08/2011
Application #:
12217086
Filing Dt:
06/30/2008
Publication #:
US20090321915
Pub Dt:
12/31/2009
Title:
SYSTEM-IN-PACKAGE AND MANUFACTURING METHOD OF THE SAME
38
Patent #:
7667318
Issue Dt:
02/23/2010
Application #:
12255868
Filing Dt:
10/22/2008
Publication #:
US20090051025
Pub Dt:
02/26/2009
Title:
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
39
Patent #:
8619431
Issue Dt:
12/31/2013
Application #:
12975698
Filing Dt:
12/22/2010
Publication #:
US20120161315
Pub Dt:
06/28/2012
Title:
THREE-DIMENSIONAL SYSTEM-IN-PACKAGE PACKAGE-ON-PACKAGE STRUCTURE
40
Patent #:
8293572
Issue Dt:
10/23/2012
Application #:
13010192
Filing Dt:
01/20/2011
Publication #:
US20120187582
Pub Dt:
07/26/2012
Title:
INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE
41
Patent #:
8637402
Issue Dt:
01/28/2014
Application #:
13311287
Filing Dt:
12/05/2011
Publication #:
US20120077340
Pub Dt:
03/29/2012
Title:
CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME
42
Patent #:
9603246
Issue Dt:
03/21/2017
Application #:
14562566
Filing Dt:
12/05/2014
Publication #:
US20150162275
Pub Dt:
06/11/2015
Title:
ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHOD OF MANUFACTURING PACKAGE CARRIER
43
Patent #:
9865561
Issue Dt:
01/09/2018
Application #:
15424878
Filing Dt:
02/05/2017
Publication #:
US20170170138
Pub Dt:
06/15/2017
Title:
ELECTRONIC PACKAGE HAVING A SUPPORTING BOARD AND PACKAGE CARRIER THEREOF
Assignor
1
ADL ENERGY CORP.
Exec Dt:
09/14/2023
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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