Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060499/0662 | |
| Pages: | 3 |
| | Recorded: | 07/13/2022 | | |
| Attorney Dkt #: | 21XD-356883-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17834666
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Filing Dt:
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06/07/2022
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Publication #:
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Pub Dt:
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12/15/2022
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Title:
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HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY POWDERS
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Assignee
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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650 TOWN CENTER DRIVE, 4TH FLOOR
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COSTA MESA, CA 92626
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06/10/2024 04:48 AM
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