Patent Assignment Details
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| Reel/Frame: | 026937/0667 | |
| Pages: | 3 |
| | Recorded: | 09/20/2011 | | |
| Attorney Dkt #: | 851663.541 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13237694
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Filing Dt:
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09/20/2011
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Publication #:
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Pub Dt:
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03/21/2013
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Title:
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HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
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Assignee
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| 5A SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554574 |
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Correspondence name and address
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WILLIAM J. PIGOTT
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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