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05/14/2009
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07/23/2009
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02/18/2010
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03/08/2011
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10/17/2008
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04/22/2010
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12/13/2011
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04/01/2010
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06/21/2011
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06/23/2011
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04/07/2011
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07/24/2012
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09/30/2010
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06/09/2011
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04/23/2013
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01/02/2014
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01/02/2014
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05/06/2014
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01/09/2014
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08/12/2014
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12/10/2013
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04/29/2013
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05/10/2013
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12/09/2013
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07/30/2015
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Filing Dt:
|
02/17/2020
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Publication #:
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Pub Dt:
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08/19/2021
| | | | |
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Title:
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Semiconductor Having a Backside Wafer Cavity for Radio Frequency (RF) Passive Device Integration and/or Improved Cooling and Process of Implementing the Same
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Patent #:
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Issue Dt:
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02/22/2022
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Application #:
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16797290
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Filing Dt:
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02/21/2020
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Publication #:
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Pub Dt:
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08/26/2021
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Title:
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Device Carrier Configured for Interconnects, a Package Implementing a Device Carrier Having Interconnects, and Processes of Making the Same
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16806754
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Filing Dt:
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03/02/2020
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Publication #:
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Pub Dt:
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09/02/2021
| | | | |
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Title:
|
System and Process for Implementing Accelerated Test Conditions for High Voltage Lifetime Evaluation of Semiconductor Power Devices
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16811161
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Filing Dt:
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03/06/2020
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Publication #:
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Pub Dt:
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09/09/2021
| | | | |
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Title:
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Radio Frequency Package Implementing a Window Frame with Edge Plating and Processes of Implementing the Same
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Patent #:
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Issue Dt:
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08/23/2022
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Application #:
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16868639
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Filing Dt:
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05/07/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Title:
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Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16876752
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Filing Dt:
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05/18/2020
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Publication #:
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Pub Dt:
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11/18/2021
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Title:
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Group III-Nitride High-Electron Mobility Transistors Configured with Recessed Source and/or Drain Contacts for Reduced On State Resistance and Process for Implementing the Same
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Patent #:
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NONE
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Issue Dt:
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06/11/2024
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Application #:
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16890503
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Filing Dt:
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06/02/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16893913
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Filing Dt:
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06/05/2020
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Publication #:
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Pub Dt:
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12/09/2021
| | | | |
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Title:
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Radio Frequency Amplifier Implementing an Input Baseband Enhancement Circuit and a Process of Implementing the Same
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Patent #:
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|
Issue Dt:
|
02/07/2023
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Application #:
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17034815
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Filing Dt:
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09/28/2020
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Publication #:
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Pub Dt:
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03/31/2022
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Title:
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Power Module Having an Elevated Power Plane with an Integrated Signal Board and Process of Implementing the Same
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17085433
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Filing Dt:
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10/30/2020
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Publication #:
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Pub Dt:
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11/11/2021
| | | | |
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Title:
|
PACKAGED TRANSISTOR HAVING DIE ATTACH MATERIALS WITH CHANNELS AND PROCESS OF IMPLEMENTING THE SAME
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Patent #:
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NONE
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Issue Dt:
|
06/04/2024
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Application #:
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17101888
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Filing Dt:
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11/23/2020
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Publication #:
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Pub Dt:
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05/26/2022
| | | | |
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Title:
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METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING BASED ON COMPONENT PARAMETERS AND DEVICES UTILIZING THE METHODS AND SYSTEMS
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Patent #:
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|
Issue Dt:
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01/02/2024
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Application #:
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17123727
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Filing Dt:
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12/16/2020
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Publication #:
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Pub Dt:
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04/08/2021
| | | | |
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Title:
|
Group III-Nitride High-Electron Mobility Transistors with Buried P-Type Layers and Process for Making the Same
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|
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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17138193
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Filing Dt:
|
12/30/2020
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Publication #:
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Pub Dt:
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06/30/2022
| | | | |
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Title:
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PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT
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|
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Patent #:
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|
Issue Dt:
|
09/13/2022
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Application #:
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17149815
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Filing Dt:
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01/15/2021
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Publication #:
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Pub Dt:
|
05/06/2021
| | | | |
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Title:
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HIGH POWER MULTILAYER MODULE HAVING LOW INDUCTANCE AND FAST SWITCHING FOR PARALLELING POWER DEVICES
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|
|
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17172669
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Filing Dt:
|
02/10/2021
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|
Publication #:
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Pub Dt:
|
06/03/2021
| | | | |
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Title:
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GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH GATE CONNECTED BURIED P-TYPE LAYERS AND PROCESS FOR MAKING THE SAME
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|
|
|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17207223
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Filing Dt:
|
03/19/2021
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|
Publication #:
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Pub Dt:
|
09/22/2022
| | | | |
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Title:
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POWER COMPONENT CONFIGURED FOR IMPROVING PARTIAL DISCHARGE PERFORMANCE AND SYSTEM AND PROCESS OF IMPLEMENTING THE SAME
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|
|
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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17228148
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Filing Dt:
|
04/12/2021
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|
Publication #:
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Pub Dt:
|
10/13/2022
| | | | |
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Title:
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POWER MODULE HAVING ELECTRICAL INTERCONNECTIONS USING MECHANICAL FITTINGS AND PROCESS OF IMPLEMENTING THE SAME
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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17228978
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Filing Dt:
|
04/13/2021
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Publication #:
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Pub Dt:
|
07/29/2021
| | | | |
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Title:
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PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FLANGE
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|
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Patent #:
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|
Issue Dt:
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06/27/2023
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Application #:
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17314160
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Filing Dt:
|
05/07/2021
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|
Publication #:
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Pub Dt:
|
08/26/2021
| | | | |
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Title:
|
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
03/12/2024
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Application #:
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17321992
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Filing Dt:
|
05/17/2021
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|
Title:
|
CIRCUITS AND GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH BURIED P-TYPE LAYERS IMPROVING OVERLOAD RECOVERY AND PROCESS FOR IMPLEMENTING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
12/12/2023
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Application #:
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17341942
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Filing Dt:
|
06/08/2021
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|
Publication #:
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Pub Dt:
|
12/08/2022
| | | | |
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Title:
|
DEVICE AND PROCESS FOR FAULT DETECTION OF A POWER DEVICE
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|
|
|
|
Patent #:
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|
Issue Dt:
|
03/19/2024
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Application #:
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17342925
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Filing Dt:
|
06/09/2021
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|
Publication #:
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|
Pub Dt:
|
12/15/2022
| | | | |
|
Title:
|
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2022
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Application #:
|
29663171
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Filing Dt:
|
09/12/2018
|
|
Title:
|
POWER MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2020
|
Application #:
|
29663172
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Filing Dt:
|
09/12/2018
|
|
Title:
|
POWER MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2022
|
Application #:
|
29676416
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Filing Dt:
|
01/10/2019
|
|
Title:
|
HOUSING FOR A POWER MODULE ASSEMBLY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2022
|
Application #:
|
29710592
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Filing Dt:
|
10/24/2019
|
|
Title:
|
Power Module Having Pin Fins
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/15/2022
|
Application #:
|
29757360
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Filing Dt:
|
11/05/2020
|
|
Title:
|
Power Module
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2023
|
Application #:
|
29821330
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Filing Dt:
|
12/29/2021
|
|
Title:
|
Power Module Having Pin Fins
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|
