Patent Assignment Details
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| Reel/Frame: | 028971/0668 | |
| Pages: | 5 |
| | Recorded: | 09/17/2012 | | |
| Attorney Dkt #: | 25599US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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13614648
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Filing Dt:
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09/13/2012
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Title:
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Electronic Package With Embedded Materials in a Molded Structure to Control Warpage and Stress
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85286 |
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Correspondence name and address
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MCANDREWS, HELD, & MALLOY
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500 WEST MADISON
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34TH FLOOR
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CHICAGO, IL 60661
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