Patent Assignment Details
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| Reel/Frame: | 031138/0668 | |
| Pages: | 5 |
| | Recorded: | 09/05/2013 | | |
| Attorney Dkt #: | 48146-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14016212
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Filing Dt:
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09/02/2013
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Publication #:
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Pub Dt:
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03/20/2014
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Title:
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MULTI-LAYER FLAT HEAT DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE CASING
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Assignee
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| NO.581, RUIGUANG RD., NEIHU DISTRICT, |
| TAIPEI CITY, TAIWAN 11492 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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