Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027264/0669 | |
| Pages: | 5 |
| | Recorded: | 11/19/2011 | | |
| Attorney Dkt #: | ESSEN-00280 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
7
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Patent #:
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Issue Dt:
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10/14/2003
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Application #:
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10162910
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Filing Dt:
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06/06/2002
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Title:
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STACKED CHIP SCALE PACKAGE STRUCTURE
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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10162912
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Filing Dt:
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06/06/2002
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Title:
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STRUCTURE OF PLATED WIRE OF FIDUCIAL MARKS FOR DIE-DICING PACKAGE
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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10637670
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Filing Dt:
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08/11/2003
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Publication #:
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Pub Dt:
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02/17/2005
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Title:
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MULTIPLE STACKED-CHIP PACKAGING STRUCTURE
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Patent #:
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Issue Dt:
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08/23/2005
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Application #:
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10739168
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Filing Dt:
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12/19/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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SUBSTRATE STRUCTURE CAPABLE OF REDUCING PACKAGE SINGULAR STRESS
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10760356
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Filing Dt:
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01/21/2004
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Publication #:
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Pub Dt:
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07/21/2005
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Title:
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STRUCTURE OF GOLD FINGERS
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Patent #:
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Issue Dt:
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08/22/2006
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Application #:
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10880738
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Filing Dt:
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07/01/2004
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Publication #:
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Pub Dt:
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01/05/2006
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Title:
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PACKAGING STACKED CHIPS WITH FINGER STRUCTURE
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10911585
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Filing Dt:
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08/05/2004
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Publication #:
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Pub Dt:
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02/09/2006
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Title:
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ELECTROPLATED WIRE LAYOUT FOR PACKAGE SAWING
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Assignee
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| NO. 699 GUOSHOUJING ROAD, PUDONG NEW AREA |
| SHANGHAI CITY, CHINA 201203 |
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Correspondence name and address
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CHENG-JU CHIANG
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P.O. BOX 766
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CHINO, CA 91708
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