Patent Assignment Details
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| Reel/Frame: | 012149/0670 | |
| Pages: | 3 |
| | Recorded: | 09/10/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09858335
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Filing Dt:
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05/15/2001
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Publication #:
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Pub Dt:
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01/24/2002
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Title:
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MANUFACTURING PROCESS FOR THE INTEGRATION IN A SEMICONDUCTOR CHIP OF AN INTEGRATED CIRCUIT INCLUDING A HIGH-DENSITY INTEGRATED CIRCUIT COMPONENTS PORTION AND A HIGH-PERFORMANCE LOGIC INTEGRATED CIRCUIT COMPONENTS PORTION
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Assignee
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| VIA C. OLIVETTI, 2 |
| 20041 AGRATE BRIANZA, ITALY |
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Correspondence name and address
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SEED INTELLECTUAL PROPERTY LAW ET AL.
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ROBERT IANNUCCI
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701 FIFTH AVE.
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SUITE 6300
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SEATTLE, WA 98104-7092
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