Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 030782/0670 | |
| Pages: | 7 |
| | Recorded: | 07/10/2013 | | |
| Attorney Dkt #: | 217730/2287 |
| Conveyance: | PATENT SECURITY AGREEMENT (SECOND LIEN) |
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Total properties:
5
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09633631
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Filing Dt:
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08/07/2000
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Title:
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OPTOCOUPLER PACKAGE BEING HERMETICALLY SEALED
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09737408
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Filing Dt:
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12/15/2000
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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INTERCONNECTION METHOD ENTAILING PROTUBERANCES FORMED BY MELTING METAL OVER CONTACT AREAS
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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10650265
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Filing Dt:
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08/28/2003
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Title:
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INTERCONNECTION METHOD
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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10718169
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Filing Dt:
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11/20/2003
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Title:
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DIGITAL INTEGRATION METHOD
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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10989882
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Filing Dt:
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11/16/2004
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Title:
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HIGH DENSITY ELECTRONIC INTERCONNECTION
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Assignee
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| ONE MADISON AVENUE |
| NEW YORK, NEW YORK 10010 |
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Correspondence name and address
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SKADDEN ARPS SLATE MEAGHER & FLOM LLP
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FOUR TIMES SQUARE
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ATTN: JOHN DEMING, ESQ.
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NEW YORK, NY 10036
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