Patent Assignment Details
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| Reel/Frame: | 051417/0670 | |
| Pages: | 6 |
| | Recorded: | 01/06/2020 | | |
| Attorney Dkt #: | CNT07047/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/26/2022
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Application #:
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16731078
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Filing Dt:
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12/31/2019
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Publication #:
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Pub Dt:
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07/09/2020
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Title:
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POWER MODULE, CHIP-EMBEDDED PACKAGE MODULE AND MANUFACTURING METHOD OF CHIP-EMBEDDED PACKAGE MODULE
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Assignee
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| 1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG |
| SHANGHAI, CHINA 201209 |
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Correspondence name and address
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CKC & PARTNERS CO., LLC
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12345 LAKE CITY WAY NE, NO. 283
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SEATTLE, WA 98125
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05/27/2024 01:36 PM
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