Patent Assignment Details
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| Reel/Frame: | 007781/0672 | |
| Pages: | 4 |
| | Recorded: | 11/22/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/1997
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Application #:
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08562007
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Filing Dt:
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11/22/1995
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Title:
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SOLDER PASTE INTER-LAYER ALIGNMENT APPARATUS AND METHOD FOR AREA-ARRAY ON-BOARD REWORK
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Assignee
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| 195 SEC. 4, CHUNG-HSING RD, CHUTUNG |
| HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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BO-IN LIN
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13445 MANDOLI DRIVE
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LOS ALTOS HILLS, CA 94022
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