Patent Assignment Details
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| Reel/Frame: | 011496/0673 | |
| Pages: | 3 |
| | Recorded: | 01/18/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09764955
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Filing Dt:
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01/18/2001
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Publication #:
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Pub Dt:
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01/03/2002
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Title:
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SEMICONDUCTOR DEVICE PACKAGING ASSEMBLY
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Assignee
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| 233, PAO CHIAO ROAD |
| HSIN TIEN TAIPEI, TAIWAN R.O.C |
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Correspondence name and address
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MAYER, FORTKORT & WILLIAMS
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STUART H. MAYER
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200 EXECUTIVE DR., SUITE 250
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WEST ORANGE, NJ 07052
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