Patent Assignment Details
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Reel/Frame: | 009179/0677 | |
| Pages: | 3 |
| | Recorded: | 05/12/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/11/1999
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Application #:
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09075879
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Filing Dt:
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05/12/1998
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Title:
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STRUCTURE FOR SEMICONDUCTOR PACKAGE FOR IMPROVING THE EFFICIENCY OF SPREADING HEAT
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Assignee
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NO. 195, SEC. 4, CHUNG-HSING RD., CHUTUNG TOWN |
HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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STEPHEN A. BECKER
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99 CANAL CENTER PLAZA
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SUITE 300
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ALEXANDRIA, VA 22314
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