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Reel/Frame:052489/0677   Pages: 3
Recorded: 04/24/2020
Attorney Dkt #:T5057-1463U
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/21/2021
Application #:
16836631
Filing Dt:
03/31/2020
Publication #:
Pub Dt:
10/15/2020
Title:
IC LAYOUT, METHOD, DEVICE, AND SYSTEM
Assignors
1
Exec Dt:
04/07/2020
2
Exec Dt:
04/13/2020
3
Exec Dt:
04/15/2020
4
Exec Dt:
04/07/2020
5
Exec Dt:
04/15/2020
Assignee
1
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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