Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027052/0681 | |
| Pages: | 23 |
| | Recorded: | 10/12/2011 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAMES OF THE CONVEYING PARTIES PREVIOUSLY RECORDED ON REEL 027034 FRAME 0407. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. |
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Total properties:
3
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Patent #:
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Issue Dt:
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10/04/1994
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Application #:
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08052518
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Filing Dt:
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04/29/1993
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Title:
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LEAD-FREE BISMUTH FREE TIN ALLOY SOLDER COMPOSITION
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Patent #:
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Issue Dt:
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04/11/1995
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Application #:
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08225826
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Filing Dt:
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04/11/1994
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Title:
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LEAD-FREE AND BISMUTH-FREE TIN ALLOY SOLDER COMPOSITION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11432299
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Filing Dt:
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05/11/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Title:
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Tin alloy solder compositions
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Assignee
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| ROYAL TRUST TOWER, 77 KING STREET WEST |
| 18TH FLOOR |
| TORONTO, ONTARIO, CANADA M5K 1A2 |
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Correspondence name and address
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CORPORATION SERVICE COMPANY
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1090 VERMONT AVENUE NW, SUITE 430
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WASHINGTON, DC 20005
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