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Reel/Frame:	048260/0683			Pages:	43
		Recorded:	02/05/2019
Attorney Dkt #:	030786-0725
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 84

Patent #:	6265776	Issue Dt:	07/24/2001	Application #:	09067381	Filing Dt:	04/27/1998
Title:	FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL

Patent #:	6123024	Issue Dt:	09/26/2000	Application #:	09231490	Filing Dt:	01/14/1999
Title:	STENCIL INCORPORATING ELECTRONIC TAG

Patent #:	6228678	Issue Dt:	05/08/2001	Application #:	09266166	Filing Dt:	03/10/1999
Title:	FLIP CHIP WITH INTEGRATED MASK AND UNDERFILL

Patent #:	6194788	Issue Dt:	02/27/2001	Application #:	09266232	Filing Dt:	03/10/1999
Title:	FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL

Patent #:	6319543	Issue Dt:	11/20/2001	Application #:	09282729	Filing Dt:	03/31/1999
Title:	PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE

Patent #:	6294220	Issue Dt:	09/25/2001	Application #:	09345675	Filing Dt:	06/30/1999
Title:	POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS

Patent #:	6323062	Issue Dt:	11/27/2001	Application #:	09395553	Filing Dt:	09/14/1999
Title:	WAFER COATING METHOD FOR FLIP CHIPS

Patent #:	6228681	Issue Dt:	05/08/2001	Application #:	09395558	Filing Dt:	09/14/1999
Title:	FLIP CHIP HAVING INTEGRAL MASK AND UNDERFILL PROVIDING TWO-STAGE BUMP FORMATION

Patent #:	6599372	Issue Dt:	07/29/2003	Application #:	09728264	Filing Dt:	12/01/2000
Publication #:	US20010042775	Pub Dt:	11/22/2001
Title:	SOLDERING FLUX

Patent #:	6524398	Issue Dt:	02/25/2003	Application #:	09834196	Filing Dt:	04/12/2001
Publication #:	US20020017337	Pub Dt:	02/14/2002
Title:	LOW-RESIDUE, LOW-SOLDER-BALL FLUX

Patent #:	6936115	Issue Dt:	08/30/2005	Application #:	10036952	Filing Dt:	12/21/2001
Publication #:	US20020187264	Pub Dt:	12/12/2002
Title:	SOLDERING FLUX VEHICLE ADDITIVE AND FINE PITCH PRINTING METHOD

Patent #:	6653741	Issue Dt:	11/25/2003	Application #:	10151741	Filing Dt:	05/20/2002
Publication #:	US20020175403	Pub Dt:	11/28/2002
Title:	THERMAL INTERFACE MATERIAL AND HEAT SINK CONFIGURATION

Patent #:	7097806	Issue Dt:	08/29/2006	Application #:	10363420	Filing Dt:	08/15/2003
Publication #:	US20050097990	Pub Dt:	05/12/2005
Title:	RAPID SURFACE COOLING OF SOLDER DROPLETS BY FLASH EVAPORATION

Patent #:	7166491	Issue Dt:	01/23/2007	Application #:	10458925	Filing Dt:	06/11/2003
Publication #:	US20040251561	Pub Dt:	12/16/2004
Title:	THERMOPLASTIC FLUXING UNDERFILL COMPOSITION AND METHOD

Patent #:	7187083	Issue Dt:	03/06/2007	Application #:	10722288	Filing Dt:	11/25/2003
Publication #:	US20040200879	Pub Dt:	10/14/2004
Title:	THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS

Patent #:	7213739	Issue Dt:	05/08/2007	Application #:	10817138	Filing Dt:	04/02/2004
Publication #:	US20050218195	Pub Dt:	10/06/2005
Title:	UNDERFILL FLUXING CURATIVE

Patent #:	7585549	Issue Dt:	09/08/2009	Application #:	10888286	Filing Dt:	07/09/2004
Publication #:	US20050106329	Pub Dt:	05/19/2005
Title:	METHOD OF APPLYING A PATTERN OF PARTICLES TO A SUBSTRATE

Patent #:	7413771	Issue Dt:	08/19/2008	Application #:	10888619	Filing Dt:	07/09/2004
Publication #:	US20050100735	Pub Dt:	05/12/2005
Title:	COATING SOLDER METAL PARTICLES WITH A CHARGE DIRECTOR MEDIUM

Patent #:	7093746	Issue Dt:	08/22/2006	Application #:	10899679	Filing Dt:	07/26/2004
Publication #:	US20040261636	Pub Dt:	12/30/2004
Title:	COATED STENCIL WITH REDUCED SURFACE TENSION

Patent #:	7247683	Issue Dt:	07/24/2007	Application #:	10911908	Filing Dt:	08/05/2004
Publication #:	US20060030682	Pub Dt:	02/09/2006
Title:	LOW VOIDING NO FLOW FLUXING UNDERFILL FOR ELECTRONIC DEVICES

Patent #:	7533793	Issue Dt:	05/19/2009	Application #:	11012457	Filing Dt:	12/15/2004
Publication #:	US20050184129	Pub Dt:	08/25/2005
Title:	SOLDER PREFORMS FOR USE IN ELECTRONIC ASSEMBLY

Patent #:	7413805	Issue Dt:	08/19/2008	Application #:	11065764	Filing Dt:	02/25/2005
Publication #:	US20060192182	Pub Dt:	08/31/2006
Title:	PREPARATION OF METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION

Patent #:	7678255	Issue Dt:	03/16/2010	Application #:	11419128	Filing Dt:	05/18/2006
Publication #:	US20060260943	Pub Dt:	11/23/2006
Title:	MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES

Patent #:	7968008	Issue Dt:	06/28/2011	Application #:	11462089	Filing Dt:	08/03/2006
Publication #:	US20080032047	Pub Dt:	02/07/2008
Title:	PARTICLES AND INKS AND FILMS USING THEM

Patent #:	7663242	Issue Dt:	02/16/2010	Application #:	11682729	Filing Dt:	03/06/2007
Publication #:	US20070145546	Pub Dt:	06/28/2007
Title:	THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS

Patent #:	9221131	Issue Dt:	12/29/2015	Application #:	11720578	Filing Dt:	07/25/2008
Publication #:	US20080292492	Pub Dt:	11/27/2008
Title:	Solder Alloy

Patent #:	8597548	Issue Dt:	12/03/2013	Application #:	11857818	Filing Dt:	09/19/2007
Publication #:	US20080145560	Pub Dt:	06/19/2008
Title:	SOLVENT SYSTEMS FOR METALS AND INKS

Patent #:	9615463	Issue Dt:	04/04/2017	Application #:	11857871	Filing Dt:	09/19/2007
Publication #:	US20080137316	Pub Dt:	06/12/2008
Title:	METHOD FOR PRODUCING A HIGH-ASPECT RATIO CONDUCTIVE PATTERN ON A SUBSTRATE

Patent #:	10123430	Issue Dt:	11/06/2018	Application #:	11873838	Filing Dt:	10/17/2007
Publication #:	US20080173698	Pub Dt:	07/24/2008
Title:	MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELATED METHODS

Patent #:	8641964	Issue Dt:	02/04/2014	Application #:	12036497	Filing Dt:	02/25/2008
Publication #:	US20080159903	Pub Dt:	07/03/2008
Title:	SOLDER ALLOY

Patent #:	8191757	Issue Dt:	06/05/2012	Application #:	12036604	Filing Dt:	02/25/2008
Publication #:	US20080160310	Pub Dt:	07/03/2008
Title:	REDUCING JOINT EMBRITTLEMENT IN LEAD-FREE SOLDERING PROCESSES

Patent #:	9362424	Issue Dt:	06/07/2016	Application #:	12052104	Filing Dt:	03/20/2008
Publication #:	US20080245765	Pub Dt:	10/09/2008
Title:	ELECTRICAL CONTACTS

Patent #:	8312623	Issue Dt:	11/20/2012	Application #:	12052166	Filing Dt:	03/20/2008
Publication #:	US20080236874	Pub Dt:	10/02/2008
Title:	METHODS FOR PRODUCING ELECTRICAL CONDUCTORS

Patent #:	8555491	Issue Dt:	10/15/2013	Application #:	12175375	Filing Dt:	07/17/2008
Publication #:	US20090025967	Pub Dt:	01/29/2009
Title:	METHODS OF ATTACHING A DIE TO A SUBSTRATE

Patent #:	8304062	Issue Dt:	11/06/2012	Application #:	12175381	Filing Dt:	07/17/2008
Publication #:	US20090061169	Pub Dt:	03/05/2009
Title:	ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM

Patent #:	8252417	Issue Dt:	08/28/2012	Application #:	12191691	Filing Dt:	08/14/2008
Publication #:	US20080296540	Pub Dt:	12/04/2008
Title:	METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION

Patent #:	7655304	Issue Dt:	02/02/2010	Application #:	12191710	Filing Dt:	08/14/2008
Publication #:	US20080299394	Pub Dt:	12/04/2008
Title:	COATED SOLDER METAL PARTICLES

Patent #:	7749883	Issue Dt:	07/06/2010	Application #:	12201654	Filing Dt:	08/29/2008
Publication #:	US20090081823	Pub Dt:	03/26/2009
Title:	ELECTROFORMED STENCILS FOR SOLAR CELL FRONT SIDE METALLIZATION

Patent #:	NONE	Issue Dt:		Application #:	12497065	Filing Dt:	07/02/2009
Publication #:	US20100139952	Pub Dt:	06/10/2010
Title:	FLUX FORMULATIONS

Patent #:	8564140	Issue Dt:	10/22/2013	Application #:	12567523	Filing Dt:	09/25/2009
Publication #:	US20100084757	Pub Dt:	04/08/2010
Title:	MONO-ACID HYBRID CONDUCTIVE COMPOSITION AND METHOD

Patent #:	9217088	Issue Dt:	12/22/2015	Application #:	13168465	Filing Dt:	06/24/2011
Publication #:	US20110318478	Pub Dt:	12/29/2011
Title:	PARTICLES AND INKS AND FILMS USING THEM

Patent #:	10535628	Issue Dt:	01/14/2020	Application #:	13287820	Filing Dt:	11/02/2011
Publication #:	US20120114927	Pub Dt:	05/10/2012
Title:	SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME

Patent #:	RE45279	Issue Dt:	12/09/2014	Application #:	13471203	Filing Dt:	05/14/2012
Title:	PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE

Patent #:	RE45175	Issue Dt:	10/07/2014	Application #:	13655159	Filing Dt:	10/18/2012
Title:	PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE

Patent #:	10905041	Issue Dt:	01/26/2021	Application #:	14027530	Filing Dt:	09/16/2013
Publication #:	US20140153203	Pub Dt:	06/05/2014
Title:	METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

Patent #:	9355938	Issue Dt:	05/31/2016	Application #:	14058553	Filing Dt:	10/21/2013
Publication #:	US20140153167	Pub Dt:	06/05/2014
Title:	CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

Patent #:	9566668	Issue Dt:	02/14/2017	Application #:	14077995	Filing Dt:	11/12/2013
Publication #:	US20140060703	Pub Dt:	03/06/2014
Title:	FLUX FORMULATIONS

Patent #:	NONE	Issue Dt:		Application #:	14095559	Filing Dt:	12/03/2013
Publication #:	US20140186524	Pub Dt:	07/03/2014
Title:	SOLVENT SYSTEMS FOR METALS AND INKS

Patent #:	NONE	Issue Dt:		Application #:	14236432	Filing Dt:	03/21/2014
Publication #:	US20140219711	Pub Dt:	08/07/2014
Title:	HIGH IMPACT TOUGHNESS SOLDER ALLOY

Patent #:	NONE	Issue Dt:		Application #:	14236480	Filing Dt:	03/21/2014
Publication #:	US20140199115	Pub Dt:	07/17/2014
Title:	SOLDER COMPOSITIONS

Patent #:	NONE	Issue Dt:		Application #:	14347035	Filing Dt:	03/25/2014
Publication #:	US20140328039	Pub Dt:	11/06/2014
Title:	SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

Patent #:	9801285	Issue Dt:	10/24/2017	Application #:	14386601	Filing Dt:	09/19/2014
Publication #:	US20150078810	Pub Dt:	03/19/2015
Title:	SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS

Patent #:	NONE	Issue Dt:		Application #:	14434470	Filing Dt:	04/09/2015
Publication #:	US20150266137	Pub Dt:	09/24/2015
Title:	LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Patent #:	10259980	Issue Dt:	04/16/2019	Application #:	14438888	Filing Dt:	04/28/2015
Publication #:	US20150353804	Pub Dt:	12/10/2015
Title:	SINTERING POWDER

Patent #:	11090768	Issue Dt:	08/17/2021	Application #:	14698450	Filing Dt:	04/28/2015
Publication #:	US20150224604	Pub Dt:	08/13/2015
Title:	LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Patent #:	NONE	Issue Dt:		Application #:	14878056	Filing Dt:	10/08/2015
Publication #:	US20160023309	Pub Dt:	01/28/2016
Title:	LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Patent #:	10494696	Issue Dt:	12/03/2019	Application #:	14900493	Filing Dt:	12/21/2015
Publication #:	US20160304989	Pub Dt:	10/20/2016
Title:	METAL RECOVERY

Patent #:	9786629	Issue Dt:	10/10/2017	Application #:	14908986	Filing Dt:	01/29/2016
Publication #:	US20160163672	Pub Dt:	06/09/2016
Title:	DUAL-SIDE REINFORCEMENT FLUX FOR ENCAPSULATION

Patent #:	10065274	Issue Dt:	09/04/2018	Application #:	14909888	Filing Dt:	02/03/2016
Publication #:	US20160175994	Pub Dt:	06/23/2016
Title:	JOINING TO ALUMINUM

Patent #:	10710336	Issue Dt:	07/14/2020	Application #:	14915067	Filing Dt:	02/26/2016
Publication #:	US20160207286	Pub Dt:	07/21/2016
Title:	COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTS

Patent #:	NONE	Issue Dt:		Application #:	15017975	Filing Dt:	02/08/2016
Publication #:	US20160225737	Pub Dt:	08/04/2016
Title:	SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME

Patent #:	NONE	Issue Dt:		Application #:	15028988	Filing Dt:	04/13/2016
Publication #:	US20160271738	Pub Dt:	09/22/2016
Title:	Lead-Free, Silver-Free Solder Alloys

Patent #:	9802275	Issue Dt:	10/31/2017	Application #:	15109352	Filing Dt:	06/30/2016
Publication #:	US20160318134	Pub Dt:	11/03/2016
Title:	Rosin-Free Thermosetting Flux Formulations

Patent #:	10059827	Issue Dt:	08/28/2018	Application #:	15148320	Filing Dt:	05/06/2016
Publication #:	US20160251495	Pub Dt:	09/01/2016
Title:	CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

Patent #:	NONE	Issue Dt:		Application #:	15265385	Filing Dt:	09/14/2016
Publication #:	US20180072573	Pub Dt:	03/15/2018
Title:	Production of Graphene

Patent #:	NONE	Issue Dt:		Application #:	15286759	Filing Dt:	10/06/2016
Publication #:	US20180102464	Pub Dt:	04/12/2018
Title:	Advanced Solder Alloys For Electronic Interconnects

Patent #:	10130995	Issue Dt:	11/20/2018	Application #:	15302712	Filing Dt:	10/07/2016
Publication #:	US20170028477	Pub Dt:	02/02/2017
Title:	METHOD FOR MANUFACTURING METAL POWDER

Patent #:	10998284	Issue Dt:	05/04/2021	Application #:	15302827	Filing Dt:	10/07/2016
Publication #:	US20170033073	Pub Dt:	02/02/2017
Title:	Low Pressure Sintering Powder

Patent #:	10465295	Issue Dt:	11/05/2019	Application #:	15312799	Filing Dt:	11/21/2016
Publication #:	US20170204523	Pub Dt:	07/20/2017
Title:	Jettable Inks For Solar Cell and Semiconductor Fabrication

Patent #:	11389865	Issue Dt:	07/19/2022	Application #:	15316684	Filing Dt:	12/06/2016
Publication #:	US20170144221	Pub Dt:	05/25/2017
Title:	Sintering Materials and Attachment Methods Using Same

Patent #:	NONE	Issue Dt:		Application #:	15318829	Filing Dt:	12/14/2016
Publication #:	US20170135227	Pub Dt:	05/11/2017
Title:	Engineered Residue Solder Paste Technology

Patent #:	10894302	Issue Dt:	01/19/2021	Application #:	15318895	Filing Dt:	12/14/2016
Publication #:	US20170113306	Pub Dt:	04/27/2017
Title:	Multilayered Metal Nano and Micron Particles

Patent #:	10322471	Issue Dt:	06/18/2019	Application #:	15326180	Filing Dt:	01/13/2017
Publication #:	US20170197281	Pub Dt:	07/13/2017
Title:	Low Temperature High Reliability Alloy for Solder Hierarchy

Patent #:	10672531	Issue Dt:	06/02/2020	Application #:	15326224	Filing Dt:	01/16/2017
Publication #:	US20170200527	Pub Dt:	07/13/2017
Title:	Stretchable Interconnects for Flexible Electronic Surfaces

Patent #:	9751159	Issue Dt:	09/05/2017	Application #:	15390861	Filing Dt:	12/27/2016
Publication #:	US20170106479	Pub Dt:	04/20/2017
Title:	Flux Formulations

Patent #:	NONE	Issue Dt:		Application #:	15419564	Filing Dt:	01/30/2017
Publication #:	US20170136583	Pub Dt:	05/18/2017
Title:	High Impact Solder Toughness Alloy

Patent #:	NONE	Issue Dt:		Application #:	15426320	Filing Dt:	02/07/2017
Publication #:	US20170245404	Pub Dt:	08/24/2017
Title:	RF SHIELD WITH SELECTIVELY INTEGRATED SOLDER

Patent #:	10462908	Issue Dt:	10/29/2019	Application #:	15439555	Filing Dt:	02/22/2017
Publication #:	US20170164484	Pub Dt:	06/08/2017
Title:	Conductive Patterns and Methods of Using Them

Patent #:	11289447	Issue Dt:	03/29/2022	Application #:	15545607	Filing Dt:	07/21/2017
Publication #:	US20180166415	Pub Dt:	06/14/2018
Title:	Method for Die and Clip Attachment

Patent #:	10625356	Issue Dt:	04/21/2020	Application #:	15549535	Filing Dt:	08/08/2017
Publication #:	US20180036818	Pub Dt:	02/08/2018
Title:	Electrical Connection Tape

Patent #:	10682732	Issue Dt:	06/16/2020	Application #:	15562195	Filing Dt:	09/27/2017
Publication #:	US20190143461	Pub Dt:	05/16/2019
Title:	Engineered Polymer-Based Electronic Materials

Patent #:	NONE	Issue Dt:		Application #:	15644331	Filing Dt:	07/07/2017
Publication #:	US20170304955	Pub Dt:	10/26/2017
Title:	High Impact Solder Toughness Alloy

Patent #:	NONE	Issue Dt:		Application #:	15716963	Filing Dt:	09/27/2017
Publication #:	US20180020554	Pub Dt:	01/18/2018
Title:	Solder Preforms and Solder Alloy Assembly Methods

Patent #:	NONE	Issue Dt:		Application #:	16003202	Filing Dt:	06/08/2018
Publication #:	US20180290244	Pub Dt:	10/11/2018
Title:	High Impact Solder Toughness Alloy

Assignor

ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)

Exec Dt:

01/31/2019

Assignee

BARCLAYS BANK PLC, AS COLLATERAL AGENT

745 SEVENTH AVENUE

27TH FLOOR

NEW YORK, NEW YORK 10019

Correspondence name and address
	LATHAM & WATKINS LLP C/O ANGELA M. AMARU
	885 THIRD AVENUE
	NEW YORK, NY 10022

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