Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 011254/0684 | |
| Pages: | 2 |
| | Recorded: | 10/11/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09613136
|
Filing Dt:
|
07/10/2000
|
Title:
|
BGA SEMICONDUCTOR PACKAGE IMPROVING SOLDER JOINT RELIABILITY AND FABRICATION METHOD THEREOF
|
|
Assignee
|
|
|
SAN 136-1, AMI-RI, BUBAL-EUB |
ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF |
|
Correspondence name and address
|
|
MORGAN, LEWIS & BOCKIUS LLP
|
|
WILLIAM O. TROUSDELL
|
|
1800 M STREET, N.W.
|
|
WASHINGTON, D.C. 20036
|
Search Results as of:
05/29/2024 09:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|